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Dive into the research topics where Larry M. Mandel is active.

Publication


Featured researches published by Larry M. Mandel.


Archive | 2003

Flip chip heat sink package and method

Larry M. Mandel; Kevin M. Gertiser; Suresh K. Chengalva; Dwadasi H.R. Sarma; David W. Zimmerman


Archive | 2003

Semiconductor device heat sink package and method

Suresh K. Chengalva; Dwadasi H.R. Sarma; David W. Zimmerman; Larry M. Mandel; Kevin M. Gertiser


Archive | 2007

Wrap-around overmold for electronic assembly

Thomas A. Degenkolb; Scott D. Brandenburg; Larry M. Mandel; Kin Yean Chow; Ching Meng Fang; Sim Ying Yong


Archive | 2004

Electronic assembly for removing heat from a flip chip

Larry M. Mandel


Archive | 2005

Overmolded electronic assembly with insert molded heat sinks

Larry M. Mandel; David A. Laudick


Archive | 2004

Technique for connector to printed circuit board decoupling to eliminate flexure

Scott D. Brandenburg; David A. Laudick; Thomas A. Degenkolb; Larry M. Mandel; Richard D. Parker


Archive | 2008

Overmolded electronic assembly with metal seal ring

Ching Meng Fang; Kin Yean Chow; Larry M. Mandel; Sim Ying Yong


Archive | 2005

Electronic assembly having a substrate laminated within a backplate cavity

Larry M. Mandel; Timothy D. Garner; Andrew R. Baker


Archive | 2006

Overmolded electronic assembly

Kin Yean Chow; Ching Meng Fang; Larry M. Mandel; Sim Ying Yong


Archive | 2005

Circuit board surface mount package

Scott E. Post; Morris D. Stillabower; Larry M. Mandel; Sim Ying Yong; Cheng Gek Cheok; Chih Kai Nah

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