Lassi Hyvönen
Nokia
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Publication
Featured researches published by Lassi Hyvönen.
workshop on signal propagation on interconnects | 2004
Ilkka Kelander; Ali Nadir Arslan; Lassi Hyvönen; Seppo Kangasmaa
This paper discusses the modeling of 3D electronic packages. A 3D model of a stacked die package solution is built and analyzed in a 3D electromagnetic (EM) simulation tool, and a lumped element RLC equivalent model is extracted. The challenges and possibilities of EM simulation are discussed. The parasitic components of the package are studied by analyzing the 3D model by parts. Strategies in specifying a Spice net list of the package model and its feasibility in circuit simulations are considered.
Archive | 2010
Lassi Hyvönen; Alexandre Pinto; Jens Troelsen
Archive | 2004
Lassi Hyvönen; Miikka Hämäläinen
Archive | 2006
Lassi Hyvönen
Archive | 2001
Lassi Hyvönen; Esko Jarvinen
Archive | 2010
Lassi Hyvönen; Joonas Krogerus; Arto Hujanen; Matti Somersalo; Pei Li
Archive | 2007
Esko Jarvinen; Lassi Hyvönen
Archive | 2004
Lassi Hyvönen; Esko Jarvinen
Archive | 2002
Ari Vilander; Mikael Svard; Lassi Hyvönen
Archive | 1996
Lassi Hyvönen; Arto Hujanen
