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Laval Chung-Long-Shan

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Publication

Featured researches published by Laval Chung-Long-Shan.

Archive | 2007

Integrated circuit support for low profile wire bond

Laval Chung-Long-Shan; Kiangkai Tankongchumruskul; Kia Silverbrook

Archive | 2009

Electronic component with wire bonds in low modulus fill encapsulant

Susan Williams; Laval Chung-Long-Shan; Kiangkai Tankongchumruskul

Archive | 2007

Method of applying encapsulant to wire bonds

Laval Chung-Long-Shan; Kiangkai Tankongchumruskul; Kia Silverbrook

Archive | 2008

Method of adhering wire bond loops to reduce loop height

Kia Silverbrook; Laval Chung-Long-Shan; Kiangkai Tankongchumruskul

Archive | 2008

METHOD OF FORMING LOW PROFILE WIRE BONDS BETWEEN INTEGRATED CIRCUITS DIES AND PRINTED CIRCUIT BOARDS

Kia Silverbrook; Laval Chung-Long-Shan; Kiangkai Tankongchumruskul

Archive | 2010

ASSEMBLY OF ELECTRONIC COMPONENTS

Kia Silverbrook; Laval Chung-Long-Shan; Kiangkai Tankongchumruskul

Archive | 2008

Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boards

Kia Silverbrook; Laval Chung-Long-Shan; Kiangkai Tankongchumruskul

Archive | 2007

METHOD OF WIRE BOND ENCAPSULATION PROFILING

Laval Chung-Long-Shan; Kiangkai Tankongchumruskul; Kia Silverbrook

Archive | 2010

Method of wire bonding an integrated circuit die and a printed circuit board

Kia Silverbrook; Laval Chung-Long-Shan; Kiangkai Tankongchumruskul

Archive | 2011

Electronic component assembly having profiled encapsulated bonds

Kia Silverbrook; Laval Chung-Long-Shan; Kiangkai Tankongchumruskul

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Collaboration

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