Leo Miglio

Scaling Hetero-Epitaxy from Layers to Three-Dimensional Crystals

Laying It on Thick The growth of one layered material onto a second lies at the heart of many electronic devices. However, if there is a lattice mismatch between the two materials, strains develop in the overgrowth material leading to bowing and cracking. Falub et al. (p. 1330; see the cover) patterned Si substrates into a series of pillars onto which they grew a germanium layer. The germanium initially coated the top of each silicon pillar but then widened as the layer thickened, leading to thick, crack-free germanium films. A space-filling array of self-limited three-dimensional epitaxial crystals averts wafer bowing, layer cracking, and dislocation propagation. Quantum structures made from epitaxial semiconductor layers have revolutionized our understanding of low-dimensional systems and are used for ultrafast transistors, semiconductor lasers, and detectors. Strain induced by different lattice parameters and thermal properties offers additional degrees of freedom for tailoring materials, but often at the expense of dislocation generation, wafer bowing, and cracks. We eliminated these drawbacks by fast, low-temperature epitaxial growth of Ge and SiGe crystals onto micrometer-scale tall pillars etched into Si(001) substrates. Faceted crystals were shown to be strain- and defect-free by x-ray diffraction, electron microscopy, and defect etching. They formed space-filling arrays up to tens of micrometers in height by a mechanism of self-limited lateral growth. The mechanism is explained by reduced surface diffusion and flux shielding by nearest-neighbor crystals.

Strain dependent gap nature of epitaxial β-FeSi2 in silicon by first principles calculations

In this letter, we show that the gap nature in β-FeSi2 is turned from indirect to direct when a suitable strain field is induced in the structure. Such a lattice deformation corresponds to a full lattice matching for the epitaxial relationship β-FeSi2(110)//Si(111), which is one of the most common orientations occurring to β-FeSi2 precipitates in silicon.

Direct Measurement of Coherency Limits for Strain Relaxation in Heteroepitaxial Core/Shell Nanowires

The growth of heteroepitaxially strained semiconductors at the nanoscale enables tailoring of material properties for enhanced device performance. For core/shell nanowires (NWs), theoretical predictions of the coherency limits and the implications they carry remain uncertain without proper identification of the mechanisms by which strains relax. We present here for the Ge/Si core/shell NW system the first experimental measurement of critical shell thickness for strain relaxation in a semiconductor NW heterostructure and the identification of the relaxation mechanisms. Axial and tangential strain relief is initiated by the formation of periodic a/2 <110> perfect dislocations via nucleation and glide on {111} slip-planes. Glide of dislocation segments is directly confirmed by real-time in situ transmission electron microscope observations and by dislocation dynamics simulations. Further shell growth leads to roughening and grain formation which provides additional strain relief. As a consequence of core/shell strain sharing in NWs, a 16 nm radius Ge NW with a 3 nm Si shell is shown to accommodate 3% coherent strain at equilibrium, a factor of 3 increase over the 1 nm equilibrium critical thickness for planar Si/Ge heteroepitaxial growth.

Monolithic Growth of Ultrathin Ge Nanowires on Si(001)

Self-assembled Ge wires with a height of only 3 unit cells and a length of up to 2 micrometers were grown on Si(001) by means of a catalyst-free method based on molecular beam epitaxy. The wires grow horizontally along either the [100] or the [010] direction. On atomically flat surfaces, they exhibit a highly uniform, triangular cross section. A simple thermodynamic model accounts for the existence of a preferential base width for longitudinal expansion, in quantitative agreement with the experimental findings. Despite the absence of intentional doping, the first transistor-type devices made from single wires show low-resistive electrical contacts and single-hole transport at sub-Kelvin temperatures. In view of their exceptionally small and self-defined cross section, these Ge wires hold promise for the realization of hole systems with exotic properties and provide a new development route for silicon-based nanoelectronics.

Unexpected Dominance of Vertical Dislocations in High-Misfit Ge/Si(001) Films and Their Elimination by Deep Substrate Patterning

An innovative strategy in dislocation analysis, based on comparison between continuous and tessellated film, demonstrates that vertical dislocations, extending straight up to the surface, easily dominate in thick Ge layers on Si(001) substrates. The complete elimination of dislocations is achieved by growing self-aligned and self-limited Ge microcrystals with fully faceted growth fronts, as demonstrated by AFM extensive etch-pit counts.

Structural, electronic and optical properties of Ru2Si3, Ru2Ge3, Os2Si3 and Os2Ge3

We have performed a comparative study of structural, electronic and optical properties of Ru 2 Si 3 , Ru 2 Ge 3 , Os 2 Si 3 and Os 2 Ge 3 by means of ultrasoft pseudopotential and full-potential linearized augmented plane wave methods. The estimated difference in the cohesion energy between the low-temperature orthorhombic phase and the high temperature tetragonal one for all these compounds indicates that the former phase is lower in energy with respect to the latter one. All materials in the orthorhombic structure are found to be direct band-gap semiconductors, still some of them in the tetragonal structure display an indirect nature (Os 2 Si 3 ) or a competitive direct-indirect character (Ru 2 Ge 3 ) of the gap. Optical properties are discussed by analyzing the imaginary part of the dielectric function and the dipole matrix elements corresponding to different interband transitions indicating for osmium silicide and germanide the presence of low-energy transitions with an appreciable value of the oscillator strength.

Electronic origin of the stability trend in TiSi2 phases with Al or Mo layers

Through a tight-binding rigid-band approach we show that changes in the relative stability of the C54, C49, and C40 phases of TiSi2, with electrons per atom ratio, are produced by the corresponding differences in the electronic density of states at the Fermi level. In particular, by increasing this ratio the stable phase evolves from C49 to C54, and then to C40. Our microscopic model provides a straightforward interpretation of very recent experimental findings concerning the sizeable variations in the transition temperature between C49 and C54 TiSi2 in the presence of Al or Mo layers.

Perfect crystals grown from imperfect interfaces

The fabrication of advanced devices increasingly requires materials with different properties to be combined in the form of monolithic heterostructures. In practice this means growing epitaxial semiconductor layers on substrates often greatly differing in lattice parameters and thermal expansion coefficients. With increasing layer thickness the relaxation of misfit and thermal strains may cause dislocations, substrate bowing and even layer cracking. Minimizing these drawbacks is therefore essential for heterostructures based on thick layers to be of any use for device fabrication. Here we prove by scanning X-ray nanodiffraction that mismatched Ge crystals epitaxially grown on deeply patterned Si substrates evolve into perfect structures away from the heavily dislocated interface. We show that relaxing thermal and misfit strains result just in lattice bending and tiny crystal tilts. We may thus expect a new concept in which continuous layers are replaced by quasi-continuous crystal arrays to lead to dramatically improved physical properties.

Theory of FeSi2 direct gap semiconductor on Si(100)

In this article we show by theory predictions how the gap nature of β-FeSi2 could be suitably tailored in heteroepitaxial growth on Si(100) substrates where a Si–Ge buffer layer is used to set the lattice parameter and, in turn, the amount of strain in the FeSi2 film.

Strain maps at the atomic scale below Ge pyramids and domes on a Si substrate

In this letter, the strain field below uncapped Ge islands of a different shape on a Si(001) substrate is estimated by molecular dynamics simulations at a realistic scale. Comparison to the Fourier transform maps of transmission electron micrographs, recently reported in literature, shows a very good agreement. We point out that the complex deformation in silicon, just below the edges of the Ge islands, is far from being uniaxial. The stress distribution generated by such a strain determines the range of interdot repulsion.