Li Yuchen

Two-dimensional threshold voltage model of a nanoscale silicon-on-insulator tunneling field-effect transistor

The tunneling field-effect transistor (TFET) is a potential candidate for the post-CMOS era. In this paper, a threshold voltage model is developed for this new kind of device. First, two-dimensional (2D) models are used to describe the distributions of potential and electric field in the channel and two depletion regions. Then based on the physical definition of threshold voltage for the nanoscale TFET, the threshold voltage model is developed. The accuracy of the proposed model is verified by comparing the calculated results with the 2D device simulation data. It has been demonstrated that the effects of varying the device parameters can easily be investigated using the model presented in this paper. This threshold voltage model provides a valuable reference to TFET device design, simulation, and fabrication.

Influence of oxygen content on the crystallinity of MgO layers in magnetic tunnel junctions

With RF sputtering process, Si/SiO2/Ta/Ru/Ta/CoFeB/MgO/CoFeB/Ta/Ru structure has been grown on Si (100) substrate. Attempting different targets and adjusting the oxygen dose, the crystallization quality of the MgO layer is studied. The X-ray diffraction measurements demonstrate that crystal structure and crystallization quality of MgO layers are related to the type of target and concentration of oxygen in sputtering process. With the method sputtering Mg in an ambient flow of oxygen, not only the crystallization quality of a normal MgO layer with lattice constant of 0.421 nm is improved, but also a new MgO crystal with lattice constant of 0.812 nm is formed and the perpendicular magnetic anisotropy of CoFeB is enhanced. Also it is found that crystallization quality for both the normal MgO and new MgO is more improved with MgO target and same oxygen dose, which means that this new method is helpful to form a new structure of MgO with lattice constant of 0.812 nm. All of the samples were annealed at 400 °C in vacuum.

The effect of substrate doping on the flatband and threshold voltages of a strained-Si pMOSFET

The effect of substrate doping on the flatband and threshold voltages of a strained-Si/SiGe p metal—oxide semiconductor field-effect transistor (pMOSFET) has been studied. By physically deriving the models of the flatband and threshold voltages, which have been validated by numerical simulation and experimental data, the shift in the plateau from the inversion region to the accumulation region as the substrate doping increases has been explained. The proposed model can provide a valuable reference to the designers of strained-Si devices and has been implemented in software for extracting the parameters of a strained-Si MOSFET.

Weak avalanche multiplication in SiGe heterojunction bipolar transistors on thin film silicon-on-insulator

In this paper, we propose an analytical avalanche multiplication model for the next generation of SiGe siliconon-insulator (SOI) heterojunction bipolar transistors (HBTs) and consider their vertical and lateral impact ionizations for the first time. Supported by experimental data, the analytical model predicts that the avalanche multiplication governed by impact ionization shows kinks and the impact ionization effect is small compared with that of the bulk HBT, resulting in a larger base-collector breakdown voltage. The model presented in the paper is significant and has useful applications in the design and simulation of the next generation of SiGe SOI BiCMOS technology.