Liang Zhizhong | Researchain

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Publication

Featured researches published by Liang Zhizhong.

Archive | 2013

Metal circuit plating and etching successive method for multilayer circuit base board with metal frame

Liang Zhizhong; Chen Lingzhi; Wang Xinchao; Liang Xinfu

Archive | 2005

Directly connected chip packaging structure

Liang Zhizhong; Liu Daoming; Zhou Zhengwei

Archive | 2015

Metal framework and electrostatic discharging ring integrated structure for fingerprint sensor and manufacturing method thereof

Liang Zhizhong; Zhang Chunyan; Wang Yaqin; Wang Sunyan; Liu Kai; Zhang Jianghua

Archive | 2014

Four-side pin-free packaging structure subjected to plating and etching sequentially and manufacturing method thereof

Wang Xinchao; Liang Zhizhong; Xie Jieren; Wu Hao

Archive | 2014

Flip chip double-faced three-dimensional circuit manufacture method by encapsulation prior to etching and flip chip double-faced three-dimensional circuit encapsulation structure

Wang Xinchao; Li Weiping; Liang Zhizhong

Archive | 2014

Secondary etching-prior-to-plating metal frame subtraction imbedded chip flip flat pin structure and process method

Wang Xinchao; Liang Zhizhong; Zhang Chunyan

Archive | 2013

Metal circuit board structure and technique of flip chip of firstly-packaged and then-etched three-dimensional system level

Liang Xinfu; Liang Zhizhong; Lin Yubin; Wang Yaqin; Zhang Youhai

Archive | 2013

Manufacture method of flip chip single-faced three-dimensional circuit manufactured by encapsulation prior to etching and flip chip single-faced three-dimensional circuit encapsulation structure

Wang Xinchao; Li Weiping; Liang Zhizhong

Archive | 2013

Flip etching-after-packaging manufacture method and packaging structure for chips with two sides and three-dimensional lines

Wang Xinchao; Li Weiping; Liang Zhizhong

Archive | 2013

Single-chip positively-arranged etched-encapsulated base island-exposed encapsulating structure and manufacturing method thereof

Wang Xinchao; Li Weiping; Liang Zhizhong

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Collaboration

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Archive Network Publication Hotspot Collaboration

Network

Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot

Dive into the research topics where Liang Zhizhong is active.

Publication

Featured researches published by Liang Zhizhong.

Metal circuit plating and etching successive method for multilayer circuit base board with metal frame

Directly connected chip packaging structure

Metal framework and electrostatic discharging ring integrated structure for fingerprint sensor and manufacturing method thereof

Four-side pin-free packaging structure subjected to plating and etching sequentially and manufacturing method thereof

Flip chip double-faced three-dimensional circuit manufacture method by encapsulation prior to etching and flip chip double-faced three-dimensional circuit encapsulation structure

Secondary etching-prior-to-plating metal frame subtraction imbedded chip flip flat pin structure and process method

Metal circuit board structure and technique of flip chip of firstly-packaged and then-etched three-dimensional system level

Manufacture method of flip chip single-faced three-dimensional circuit manufactured by encapsulation prior to etching and flip chip single-faced three-dimensional circuit encapsulation structure

Flip etching-after-packaging manufacture method and packaging structure for chips with two sides and three-dimensional lines

Single-chip positively-arranged etched-encapsulated base island-exposed encapsulating structure and manufacturing method thereof

Collaboration

Dive into the Liang Zhizhong's collaboration.