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Liu Zhihua

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Publication

Featured researches published by Liu Zhihua.

Archive | 2017

A integrated circuit lead frame for high power device

Chen Lin; Zheng Tianfeng; Zhu Shizhen; Han Zhuangyong; Zhu Wenfeng; Wu Fuyou; Liu Zhihua; Liu Qunying; Zhu Haitao; Zhang Tuanjie; Wang Pengfei; Cao Bingping; Zhou Beibei

Archive | 2017

Novel high density frame construction of semiconductor package circuit

Chen Lin; Zheng Tianfeng; Zhu Shizhen; Han Zhuangyong; Zhu Wenfeng; Wu Fuyou; Liu Zhihua; Liu Qunying; Zhu Haitao; Zhang Tuanjie; Wang Pengfei; Cao Bingping; Zhou Beibei

Archive | 2017

Novel packaging structure of integrated circuit S0T

Chen Lin; Zheng Tianfeng; Zhu Shizhen; Han Zhuangyong; Zhu Wenfeng; Wu Fuyou; Liu Zhihua; Liu Qunying; Zhu Haitao; Zhang Tuanjie; Wang Pengfei; Cao Bingping; Zhou Beibei

Archive | 2017

Be applied to SOT23 semiconductor package's integrated circuit

Chen Lin; Zheng Tianfeng; Zhu Shizhen; Han Zhuangyong; Zhu Wenfeng; Wu Fuyou; Liu Zhihua; Liu Qunying; Zhu Haitao; Zhang Tuanjie; Wang Pengfei; Cao Bingping; Zhou Beibei

Archive | 2017

Be applied to many legs position integrated circuit of high power device

Chen Lin; Zheng Tianfeng; Zhu Shizhen; Han Zhuangyong; Zhu Wenfeng; Wu Fuyou; Liu Zhihua; Liu Qunying; Zhu Haitao; Zhang Tuanjie; Wang Pengfei; Cao Bingping; Zhou Beibei

Archive | 2017

Semiconductor package's is novel from lock frame construction

Chen Lin; Zheng Tianfeng; Zhu Shizhen; Han Zhuangyong; Zhu Wenfeng; Wu Fuyou; Liu Zhihua; Liu Qunying; Zhu Haitao; Zhang Tuanjie; Wang Pengfei; Cao Bingping; Zhou Beibei

Archive | 2016

A prevent frame that breaks for wrapper spare

Chen Lin; Zhang Tuanjie; Wu Fuyou; Wang Pengfei; Cao Bingping; Zhou Beibei; Liu Zhihua

Archive | 2014

Dicing saw for semiconductor packaging

Chen Lin; Zhu Shizhen; Han Zhuangyong; Zheng Tianfeng; Zhu Wenfeng; Ren Shuke; Liu Zhihua; Cao Bingping; Wang Pengfei; Zhou Beibei; Zhang Tuanjie; Zhu Haitao; Lyu Xiaojiang

Archive | 2014

Lead frame used for two different packaging technology requirements

Chen Lin; Zhu Shizhen; Han Zhuangyong; Zheng Tianfeng; Zhu Wenfeng; Ren Shuke; Liu Zhihua; Cao Bingping; Wang Pengfei; Zhou Beibei; Zhang Tuanjie; Zhu Haitao; Lyu Xiaojiang

Archive | 2014

Tinned-back chip used for semiconductor eutectic process package

Chen Lin; Zhu Shizhen; Han Zhuangyong; Zheng Tianfeng; Zhu Wenfeng; Ren Shuke; Liu Zhihua; Cao Bingping; Wang Pengfei; Zhou Beibei; Zhang Tuanjie; Zhu Haitao; Lyu Xiaojiang

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Chen Lin

Fudan University

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