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Dive into the research topics where Lu Congda is active.

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Featured researches published by Lu Congda.


international conference on digital manufacturing & automation | 2012

Forming Numerical Simulation of Proton Exchange Membrane Fuel Cell Metallic Bipolar Plates

Wu Mingge; Lu Congda; Su Yujing

The manufacturing costs of metallic bipolar plates for PEMFC have hindered it from commercialization for long. As the most common sheet metal forming methods, stamping and hydroforming are not popularly dealing metallic bipolar plates. This study focuses on the stamping and hydroforming numerical simulation based on DYNARORM by using metallic bipolar plates of thickness of 0.1mm, verifies the feasibility of the stamping and hydroforming and compared to find hydroforming obtains better quality in channel height and surface integrity, which is more suitable for the forming of thin metallic bipolar plates.


Thin Solid Films | 2016

Effects of metal buffer layer for amorphous carbon film of 304 stainless steel bipolar plate

Wu Mingge; Lu Congda; Tan Dapeng; Hong Tao; Chen Guohai; Wen Donghui


International Journal of Energy Research | 2017

A novel intersectant flow field of metal bipolar plate for proton exchange membrane fuel cell

Wen Donghui; Yin Linzhi; Piao Zhong-yu; Lu Congda; Li Gang; Leng Qiaohui


Archive | 2015

Grinding mechanism for fractal path

Lu Congda; Chen Zhenzhen; Wen Donghui


Archive | 2015

Wafer polishing magnetic loading clamping device

Wang Yangyu; Wen Donghui; Ji Shiming; Lu Congda; Piao Zhongyu; Zhou Haodong


Surface & Coatings Technology | 2016

Chromium interlayer amorphous carbon film for 304 stainless steel bipolar plate of proton exchange membrane fuel cell

Wu Mingge; Lu Congda; Hong Tao; Chen Guohai; Wen Donghui; Zhang Haifeng; Zhang Dong; Wang Aiying


Archive | 2013

Magnetic-loading wafer polishing device

Wang Yangyu; Zhou Haodong; Ji Shiming; Wen Donghui; Lu Congda; Piao Zhongyu


Archive | 2013

Magnetic loaded wafer grinding method and magnetic loaded wafer grinding device

Wang Yangyu; Wen Donghui; Piao Zhongyu; Ji Shiming; Lu Congda; Zhou Haodong


Archive | 2013

Wafer grinding magnetic loading and clamping device

Wang Yangyu; Piao Zhongyu; Ji Shiming; Wen Donghui; Lu Congda; Zhou Haodong


Thin Solid Films | 2017

Corrigendum to “Effects of metal buffer layer for amorphous carbon film of 304 stainless steel bipolar plate” [Thin Solid Films 616 (2016) 507–514]

Wu Mingge; Lu Congda; Tan Dapeng; Chen Guohai; Wen Donghui; Zhang Haifeng; Zhang Dong; Wang Aiying

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Wen Donghui

Zhejiang University of Technology

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Liang Lihua

Zhejiang University of Technology

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Wang Yangyu

Zhejiang University of Technology

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Wu Mingge

Zhejiang University of Technology

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Chai Guozhong

Zhejiang University of Technology

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Ji Shiming

Zhejiang University of Technology

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Piao Zhongyu

Zhejiang University of Technology

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Chen Guohai

Zhejiang University of Technology

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Hong Tao

Zhejiang University of Technology

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Jin Mingsheng

Zhejiang University of Technology

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