M. Fryziel

Smart antenna based on RF MEMS switches and printed Yagi-Uda antennas for 60 GHz ad hoc WPAN

A compact printed Yagi-Uda (or quasi-Yagi) antenna has been designed on a standard high permittivity substrate (GaAs). The antenna results in a directivity of 6 dBi and a 12% bandwidth. We use this antenna to design a smart antenna fed through a SP6T (single pole six throws). The SP6T is based on MEMS switches designed and realized in the IEMN. In this paper, we present the designing, the manufacturing process for both antenna and switch and their first results

BCB Cap Packaging of MEMS Switches Integrated With 100-

This paper presents benzocyclobutene (BCB) cap packaging of Microelectromechanical systems (MEMS) switches integrated with a thin monolithic microwave integrated circuit (MMIC) wafer. To prevent a possible breakage during BCB bonding process, the 100-μm-thick MMIC wafer is bonded to 680-μm-thick GaAs support before the release of MEMS switches. BCB cap packaging has been performed through BCB cap transfer technique based on antiadhesion monolayered Si carrier wafer. The thick GaAs support wafer has been separated by polymethyl methacrylate (PMMA) sacrificial etching through perforated access holes. The packaged MMIC wafer has been successfully diced using conventional dicing machine. The implemented BCB caps on the target MMIC have the height of 25 μm and the cavity of 12 μm for the housing of MEMS switches. The achieved success rate of BCB caps transfer is ~ 95%. The BCB cap packaging effect to microstrip line has been investigated through the S-parameters measurement before and after the packaging. In addition, the packaged MEMS switch shows the insertion loss of 0.7 dB, the return loss of 25 dB, and the isolation of 20 dB at 30 GHz.

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This paper presents the performance of a millimeter wave (MMW) positioning system operating in indoor environment and using broadband impulse signals. The main original contribution is an approach based on a focusing technique to minimize the performance degradations due to the multipath propagation. Experimental results validate the ability of the topology to perform multi-laterations based on a specific cooperation between sensors. The used focusing technique is detailed and its impact on the positioning accuracy is validated by numerous measurements.

MMIC Wafer

This paper presents a BCB cap packaging of MEMS switches integrated with MMIC and its electrical and mechanical effects to the packaged devices have been also investigated. To prevent a possible breakage during BCB bonding process, the 100 µm-thick MMIC wafer is bonded to 680 µm-thick GaAs support that will be finally released using PMMA sacrificial etching. The implemented BCB caps on the target MMIC have the height of 28 µm and the cavity of 13 µm for the housing of MEMS switches. The achieved success rate of BCB caps transfer is approximately 80 %. The BCB cap packaging effect to microstrip line has been investigated through the S-parameters measurement before and after the packaging. Also, the packaged MEMS switch shows the insertion loss of 0.7 dB, the return loss of 25 dB and the isolation of 18 dB at 30 GHz.

Millimeter-wave broadband positioning system for indoor applications

This paper presents a novel compact circuit design of an RF-MEMS frequency-agile LNA realized in a GaAs MMIC process that also includes a BCB cap type of wafer-level package. The uncapped/BCB capped single-chip GaAs MEMS tunable LNA circuits which can be matched at different frequency bands (e.g at X-band and Ku-/K-band) present similar in-band gain, linearity and noise figure over 30-60% wide tuning ranges (the uncapped MEMS tunable LNA has an NF≤3 dB at 14-21 GHz with ≤0.6 dB higher NF at 9-13 GHz). The validated MMIC designs are first time realizations of uncapped/0-level packaged MEMS tunable (wide-band/narrow-band) LNAs in a GaAs foundry process.