M. H. Gelchinski

Laser‐enhanced jet plating: A method of high‐speed maskless patterning

We describe a metal deposition technique that combines free‐standing jet plating with an intense laser beam, directed collinearly along the jet. Experiments were made to deposit gold areas on nick‐plated beryllium‐copper substrates. The deposits are found to be crack‐free and dense, possessing excellent adhesion to the substrate. Deposition rates for 0.05‐cm‐diam gold spots are on the order of 10 μm/s, faster than any previously reported rate for gold plating.

Maskless Laser Plating Techniques For Microelectronic Materials

We describe techniques for laser enhanced plating of gold, nickel and copper. This maskless plating results in speeds up to 103 times that of conventional plating. Mechanisms and applications are discussed.

Laser Enhanced Electroplating

Over the past several years we have investigated methods of high speed maskless deposition using a focused laser beam to produce both localization and substantial deposition enhancement compared to non-irradiated background (1–3). The patterns, produced from solution can be divided into two main categories; laser enhanced electroplating and laser enhanced electrodless plating. The latter category includes depositions produced without an external electomotive force and has been described in several other references (4). The enhancement mechanisms for laser enhanced electroplating have been investigated in considerable detail for the system Cu/Cu++ in conjunction with a focused argon laser using microscope slide glass substrates with a thin predeposited metal layer (3).