M.W. Nield

Hybrid integration of monolithic semiconductor optical amplifier arrays using passive assembly

Passive assembly of single mode optoelectronic components is a prerequisite for some of the more advanced functional devices emerging in the marketplace. For example, in optical processing circuits (Cotter, 1995) it is essential to have serially cascaded active devices with time of flight control of the optical data. In such cases, the functionality cannot be achieved through any means other than hybrid integration of monolithic active chips with passive planar waveguides. This paper describes a high performance integration platform that can scale to high levels of monolithic chip integration on a hybrid waveguide motherboard which is suitable for these applications.

Tapered active layer laser device performance and its impact on low cost optoelectronics

75% coupling to cleaved single mode fibre has been obtained for a 1.55 /spl mu/m tapered active strained MQW layer device. A fully packaged component using precision laser die cleaving and a silicon micro machined substrate has produced a record 55% passive coupling.

Hybrid integration of optical and electronic components on a silicon motherboard

We have demonstrated silicon motherboard transmitter and receiver modules with planar silica waveguide optical interconnects. In both modules the active optoelectronic components were passively aligned to the silica waveguides, and electronic circuitry was also hybrid integrated. We are now- developing motherboards which include an electrical interconnect layer formed directly on the silicon, in order to overcome the limitations encountered with bond-wires.

Performance of silica-on-silicon waveguides for optical signal processing

Silica-on-silicon waveguiding components are of great importance in the construction of an all optical signal processing network. By using arsenosilicate glass (ASG) waveguides a tight optical confinement can be achieved thus allowing a high device packing density. This paper examines differences in waveguide curvature and reflow conditions then illustrates how they affect the device loss.

Monolithic 16-channel Fourier-optic-based WDM in planar silica

As work on wavelength multiplexed networks matures, it is becoming increasingly clear that there is a need for small, monolithic WDM elements for practical implementation. It is the purpose of this paper to discuss the design and fabrication of one such element, produced using silica waveguides on silicon. The design parameters for the device are for 16 channels of 1 nm bandwidth, with 2 nm channel separation, operating in the third telecoms wavelength region and coincident with the erbium fiber amplifier.