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Makoto Kataoka

Honda

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Publication

Featured researches published by Makoto Kataoka.

Archive | 2003

Surface protecting adhesive film for semiconductor wafer and protecting method for semiconductor wafer using said adhesive film

Masafumi Miyakawa; Makoto Kataoka; Yasuhisa Fujii; Yoshihisa Saimoto; Shinichi Hayakawa

Archive | 2003

Pressure-sensitive adhesive film for the surface protection of semiconductor wafers and method for protection of semiconductor wafers with the film

Masafumi Miyakawa; Makoto Kataoka; Jun Nakashima; Yoshihisa Saimoto; Shinichi Hayakawa; Yasuhisa Fujii

Archive | 1999

Preparation process of semiconductor wafer

Makoto Kataoka; Yasuhisa Fujii; Kentaro Hirai; Hideki Fukumoto; Masatoshi Kumagai

Archive | 2005

Method of protecting semiconductor wafer and adhesive film for protection of semiconductor wafer

Takanobu Koshimizu; Makoto Kataoka; Masafumi Miyakawa; Hideki Fukumoto; Yoshihisa Saimoto

Archive | 2001

Protecting method for semiconductor wafer and surface protecting adhesive film for semiconductor wafer used in said method

Yoshihisa Saimoto; Yasuhisa Fujii; Makoto Kataoka; Kentaro Hirai; Hideki Fukumoto; Takanobu Koshimizu

Archive | 2000

Adhesive film for protecting semiconductor wafer and method for processing back of semiconductor wafer using the same

Yasuhisa Fujii; Hideki Fukumoto; Kentaro Hirai; Makoto Kataoka; Masatoshi Kumagai; Jun Nakajima; 純 中島; 健太郎 平井; 誠敏 熊谷; 片岡 真; 英樹 福本; 藤井 靖久

Archive | 2003

Adhesive film for protecting front surface of semiconductor wafer and protecting method for semiconductor wafer using the adhesive film

Yasuhisa Fujii; Shinichi Hayakawa; Makoto Kataoka; Seishi Miyagawa; Jun Nakajima; Yoshihisa Saimoto; 中島 純; 宮川 誠史; 才本 芳久; 早川 慎一; 片岡 真; 藤井 靖久

Archive | 2002

Adhesive film for protecting surface of semiconductor wafer and method for protecting such semiconductor wafer using the same

Yasuhisa Fujii; Shinichi Hayakawa; Makoto Kataoka; Seishi Miyagawa; Yoshihisa Saimoto; 誠史 宮川; 芳久 才本; 慎一 早川; 片岡 真; 藤井 靖久

Archive | 1998

Adhesive film for grinding back surface of semiconductor wafer and method for grinding back surface of semiconductor wafer

Yasuhisa Fujii; Hideki Fukumoto; Kentaro Hirai; Makoto Kataoka; Masatoshi Kumagai; Seishi Miyagawa; 誠史 宮川; 健太郎 平井; 誠敏 熊谷; 片岡 真; 英樹 福本; 藤井 靖久

Archive | 2010

Hydraulic clutch device

Atsushi Ogasawara; Junya Watanabe; Masahiko Tsuchiya; Akio Ooishi; Makoto Kataoka; Katsu Yoshimoto

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Daisuke Suzuki

Hitachi

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