Makoto Taki

Development of Y-Shaped Filtered-Arc-Deposition System for Preparing Multielement Composition-Controlled Film

In recent years, multielement films have been required for high-performance cutting tools. In this paper, a Y-shaped filtered-arc-deposition (Y-FAD) system with two vacuum-arc sources was developed. First, an optimum magnetic coil arrangement was experimentally established to transport two plasma beams through the Y-shaped duct at the same time. Since the two plasma beams have the same electrical polarity, they naturally tend to repel each other. Therefore, in the second step, the two plasma beams were combined into one plasma beam through a mixer part by vibrating the plasma beams with a laterally oscillating magnetic field. Third, the electrical bias applied to the duct was optimized to obtain a higher transportation rate of plasma and deposition rate. After these design developments and tuning, titanium-aluminum (Ti-Al) film with a combined deposition pattern was finally obtained with Al and Ti cathodes. The controllability of the composition ratio by the arc current was verified.

Removal of Diamond-Like Carbon Film by Oxygen-Dominated Plasma Beam Converted from Filtered Carbon-Cathodic Arc

Diamond-like carbon (DLC) film is sometimes removed using oxygen plasma in order to reuse workpieces such as cutting tools and press molds. In this study, an oxygen-dominated plasma beam was generated by converting the cathodic carbon arc plasma beam formed in T-shaped filtered-arc-deposition (T-FAD) in order to investigate the feasibility of using the plasma beam for the removal of DLC film. When the oxygen (O2) gas flow rate was relatively high (50 ml/min) and the substrate was biased (DC -500 V), the plasma beam in front of the substrate was confirmed to contain a considerable amount of excited oxygen atoms, since an atomic oxygen spectral line (777 nm) emitted from the plasma beam had relatively strong radiation intensity. The plasma beam was irradiated on a tetrahedral amorphous carbon film, a hydrogen-free sp3-rich DLC film, prepared on a hard alloy (WC with 6 wt % Co binder) substrate. It was found that a plasma beam generated with an appropriate O2 gas flow rate and applied substrate bias was able to etch the DLC film proportionally to the treatment time. The surface was not roughened when the treatment time was 1.5 times longer than the intended time to remove a given thickness of DLC film.

Improvement of adhesion of hydrogen-free DLC film by employing an interlayer of tungsten carbide

Materials with poor adhesion present a problem for the application of diamond-like carbon (DLC) films. As a method for solving this problem, there is a technique that deposits an interlayer of metal between the DLC film and substrate. A tungsten carbide film (W-C film) is used as the interlayer. In this study, the effect of introducing the W-C interlayer on the adhesion of the DLC film was investigated. The W-C films were deposited using two types of cemented tungsten carbides (WCs) as the cathode, one containing Co (WC-Co) and the other containing Ti (WC-Ti), as a binder for forming the cathode shape. It is necessary to control the film thickness of the interlayer to introduce the interlayer to the DLC film. The film thickness control of W-C films became possible by using a discharge counter. DLC films were deposited using a bias voltage of -100 V. The film thicknesses of the W-C interlayer and DLC film at the time of investigating adhesion were 30 nm and 300 nm, respectively. The result of the tape-peel...

Fabrication of nitrogen-containing diamond-like carbon film by filtered arc deposition as conductive hard-coating film

Diamond-like carbon (DLC) films, which are amorphous carbon films, have been used as hard-coating films for protecting the surface of mechanical parts. Nitrogen-containing DLC (N-DLC) films are expected as conductive hard-coating materials. N-DLC films are expected in applications such as protective films for contact pins, which are used in the electrical check process of integrated circuit chips. In this study, N-DLC films are prepared using the T-shaped filtered arc deposition (T-FAD) method, and film properties are investigated. Film hardness and film density decreased when the N content increased in the films because the number of graphite structures in the DLC film increased as the N content increased. These trends are similar to the results of a previous study. The electrical resistivity of N-DLC films changed from 0.26 to 8.8 Ω cm with a change in the nanoindentation hardness from 17 to 27 GPa. The N-DLC films fabricated by the T-FAD method showed high mechanical hardness and low electrical resistivity.

Preparation of multi-layer film consisting of hydrogen-free DLC and nitrogen-containing DLC for conductive hard coating

Conductive hard-coating films have potential application as protective films for contact pins used in the electrical inspection process for integrated circuit chips. In this study, multi-layer diamond-like carbon (DLC) films were prepared as conductive hard-coating films. The multi-layer DLC films consisting of DLC and nitrogen-containing DLC (N-DLC) film were prepared using a T-shape filtered arc deposition method. Periodic DLC/N-DLC four-layer and eight-layer films had the same film thickness by changing the thickness of each layer. In the ball-on-disk test, the N-DLC mono-layer film showed the highest wear resistance; however, in the spherical polishing method, the eight-layer film showed the highest polishing resistance. The wear and polishing resistance and the aggressiveness against an opponent material of the multi-layer DLC films improved by reducing the thickness of a layer. In multi-layer films, the soft N-DLC layer between hard DLC layers is believed to function as a cushion. Thus, the tribolog...