Marc Bernacki
École Normale Supérieure
Network
Latest external collaboration on country level. Dive into details by clicking on the dots.
Publication
Featured researches published by Marc Bernacki.
MATERIALS PROCESSING AND DESIGN; Modeling, Simulation and Applications; NUMIFORM '07; Proceedings of the 9th International Conference on Numerical Methods in Industrial Forming Processes | 2007
Marc Bernacki; Hugues Digonnet; Héba Resk; Thierry Coupez; Roland E. Logé
This work is currently under development within the framework of an American‐European project (Digimat Project). The paper details the development of some numerical tools dedicated to the digital representation of metallic materials structures, to the finite element modelling of the polycrystalline microstructure deformation under large strains and to the subsequent recrystallization. The level set method used for the description of the microstructure interfaces is shown to represent a common base to all these developments.
Materials Science Forum | 2013
Nathalie Bozzolo; Andrea Agnoli; Nadia Souaï; Marc Bernacki; Roland E. Logé
Under certain circumstances abnormal grain growth occurs in Nickel base superalloys during thermomechanical forming. Second phase particles are involved in the phenomenon, since they obviously do not hinder the motion of some boundaries, but the key parameter is here the stored energy difference between adjacent grains. It induces an additional driving force for grain boundary migration that may be large enough to overcome the Zener pinning pressure. In addition, the abnormal grains have a high density of twins, which is likely due to the increased growth rate.
Materials Research Express | 2015
Pierre Bellanger; Pierre-Olivier Bouchard; Marc Bernacki; J.M. Serra
The stress induced lift-off method (SLIM) -cut technique allows the detachment of thin silicon foils using a stress inducing layer. In this work, results of SLIM-cut foils obtained using an epoxy stress inducing layer at room temperature are presented. Numerical analyses were performed in order to study and ascertain the important experimental parameters. The experimental and simulation results are in good agreement. Indeed, large area (5 × 5 cm2) foils were successfully detached at room temperature using an epoxy thickness of 900 μm and a curing temperature of 150 °C. Moreover, three foils (5 × 3 cm2) with thickness 135, 121 and 110 μm were detached from the same monocrystalline substrate. Effective minority carrier lifetimes of 46, 25 and 20 μs were measured using quasi-steady-state photoconductance technique in these foils after iodine ethanol surface passivation.
Scripta Materialia | 2008
Marc Bernacki; Yvan Chastel; Thierry Coupez; Roland E. Logé
Metals | 2015
Yuan Jin; Marc Bernacki; Andrea Agnoli; Brian Lin; Gregory S. Rohrer; Anthony D. Rollett; Nathalie Bozzolo
International Journal of Material Forming | 2008
Marc Milesi; Yvan Chastel; Marc Bernacki; Roland E. Logé; Pierre-Olivier Bouchard
18ème Congrès Français de Mécanique Grenoble-CFM 2007 | 2007
Hugues Digonnet; Marc Bernacki; Luisa Silva; Thierry Coupez
FEMS Junior EUROMAT | 2018
Flore Villaret; Benjamin Hary; Yann De Carlan; Roland E. Logé; Thierry Baudin; Nathalie Bozzolo; Marc Bernacki
ECCM - ECFD 2018 | 2018
Ludovic Maire; Julien Fausty; Marc Bernacki; Nathalie Bozzolo; Pierre De Micheli; Charbel Moussa
ECCM - ECFD 2018 | 2018
Julien Fausty; Marc Bernacki; Daniel Pino Muñoz; Nathalie Bozzolo