Marcin B. Bauza

Development of a virtual probe tip with an application to high aspect ratio microscale features

Nondestructive measurement of microscale features remains a challenging metrology problem. For example, to assess a high aspect ratio small hole it is currently common to cut a cross section and measure the features of interest using an atomic force microscope, scanning probe microscope, or scanning electron microscope. Typically, these metrology tools may be suitable for surface finish measurement but often lack the capability for dimensional metrology. The aim of this article is to discuss the development of a high aspect-ratio microscale probe for measurement of microscale features. A 700:1 high aspect ratio probe shank is fabricated with a 7μm diameter, and attached at one end to an oscillator. The oscillator produces a standing wave in the oscillating probe shank as opposed to conventional probes that use a microscale sphere on the end of a comparatively rigid shank. As a result of the standing wave formed in steady state vibration, the free end of the shank generates an amplitude of oscillation grea...

Standing wave probes for microassembly

A single standing wave sensor was investigated and experiments demonstrated release capability of glass microscale objects. It is shown that this micrometer scale fiber may be employed as miniaturized tweezers able to pick up specimens and routinely release them when the standing wave is energized. Furthermore, it is demonstrated that the standing wave probe has sensing capability. Both phase and magnitude indicate when the specimen releases, and also provide postrelease information such as mass of sphere and its rotation about its own axis or, surprisingly, about the probe fiber. The current experiments investigated only the release forces acting normal to the sphere/fiber contact interface. Some work was performed by changing the virtual tip from a normally applied force to a tangential applied force. In this condition, the specimen was observed to release differently.