Marco Martinelli

Process for the production of printed circuit boards with extremely dense wiring using a metal-clad laminate

Process for producing connecting conductors

Thin laminated microstructure with precisely aligned openings

Method of manufacturing multilayer foil printed circuit boards

Specific microsieve, specific composite body

Fabrication of multilayer circuit boards with increased conductor density

Core for electrical connecting substrates and electrical connecting substrates with core, as well as process for the production thereof

Process for the production of structures

Insulating foil circuit board with rigid and flexible sections

Process for producing printed circuit boards using a semi-finished product with extremely dense wiring for signal conduction