Marian S. Kennedy

Effect of nanoscale patterned interfacial roughness on interfacial toughness.

The performance and the reliability of many devices are controlled by interfaces between thin films. In this study we investigated the use of patterned, nanoscale interfacial roughness as a way to increase the apparent interfacial toughness of brittle, thin-film material systems. The experimental portion of the study measured the interfacial toughness of a number of interfaces with nanoscale roughness. This included a silicon interface with a rectangular-toothed pattern of 60-nm wide by 90-nm deep channels fabricated using nanoimprint lithography techniques. Detailed finite element simulations were used to investigate the nature of interfacial crack growth when the interface is patterned. These simulations examined how geometric and material parameter choices affect the apparent toughness. Atomistic simulations were also performed with the aim of identifying possible modifications to the interfacial separation models currently used in nanoscale, finite element fracture analyses. The fundamental nature of atomistic traction separation for mixed mode loadings was investigated.

Mechanical properties of wear tested LIGA nickel.

Strength, friction, and wear are dominant factors in the performance and reliability of materials and devices fabricated using nickel based LIGA and silicon based MEMS technologies. However, the effects of frictional contacts and wear on long-term performance of microdevices are not well-defined. To address these effects on performance of LIGA nickel, we have begun a program employing nanoscratch and nanoindentation. Nanoscratch techniques were used to generate wear patterns using loads of 100, 200, 500, and 990 {micro}N with each load applied for 1, 2, 5, and 10 passes. Nanoindentation was then used to measure properties in each wear pattern correcting for surface roughness. The results showed a systematic increase in hardness with applied load and number of nanoscratch passes. The results also showed that the work hardening coefficient determined from indentation tests within the wear patterns follows the results established from tensile tests, supporting use of a nanomechanics-based approach for studying wear.

The Role of Adhesion and Fracture on the Performance of Nanostructured Films

Nanostructured materials are the basis for emerging technologies, such as MEMS, NEMS, sensors, and flexible electronics, that will dominate near term advances in nanotechnology. These technologies are often based on devices containing layers of nanoscale polymer, ceramic and metallic films and stretchable interconnects creating surfaces and interfaces with properties and responses that differ dramatically from bulk counterparts. The differing properties can induce high interlaminar stresses that lead to wrinkling, delamination, and buckling in compression [1,2], and film fracture and decohesion in tension. [3] However, the relationships between composition, structure and properties, and especially adhesion and fracture, are not well-defined at the nanoscale. These relationships are critical to assuring performance and reliability of nanostructured materials and devices. They are also critical for building materials science based predictive models of structure and behavior.

INVESTIGATION OF INDENTATION METHODS FOR PROPERTIES DETERMINATION IN HARD FILM – SOFT SUBSTRATE SYSTEMS

Elastic modulus values of the thin films utilized in three different hard film- soft substrate systems were measured using a combination of traditional and continuous stiffness indentation. These systems were chosen to represent typical systems currently utilized in MEMS and included Si/SU8/W, Si/SiO 2 /Ti/Pt/PZT, and Si/SiO 2 /Ti/Pt. The last system was coated with either a compressive or nonstressed Cr film. By taking into account ratio between the creep due to the polymer substrate, SU8, to the unloading rate, the modulus of W was measured to be 400 GPa. The modulus of the SU8 was also determined to be 6 GPa. Comparing both the CSM and traditional indentation for the Si/SiO 2 /Ti/Pt/PZT system showed that the dynamic motion of the indenter caused pile-up in the PZT and resulting in the overestimation of the PZT modulus. This pile-up is a function of the sinusoidal loading frequency. Instead, the modulus of the PZT was measured by shallow depths of traditional indentation that resulted in the PZT modulus of 100 GPa. The hard film-soft substrate systems were show to follow the same trend as stressed soft-film hard-substrate systems with residual stress. The modulus was over estimated for compressively stressed Cr films.