Mark Anthony Paczkowski

Silsesquioxane Resins as High‐Performance Solution Processible Dielectric Materials for Organic Transistor Applications

Silsesquioxane polymers have been successfully used as the dielectric layer in organic field-effect transistors (FETs) deposited on robust, plastic substrates. Performance comparable to that found with silicon substrates having SiO2 as the active dielectric layer was observed with six p- and n- channel organic semiconductors. These organopolysiloxane materials can be deposited using conventional liquid coating technologies and are compatible with non-photolithographic microcontact printing. Their low curing temperature permits the use of a variety of low-cost plastic materials as substrates in FET devices. These findings have facilitated the realization of low-cost, large area plastic electronics.

238 x 238 micromechanical optical cross connect

This letter describes a 238/spl times/238 beam-steering optical cross connect constructed using surface micromachined mirrors. Its innovative optical configuration resulted in superior optical performance, achieving a mean fiber-to-fiber insertion loss of 1.33 dB and a maximum insertion loss for all 56 644 connections of 2 dB.

238/spl times/238 surface micromachined optical crossconnect with 2dB maximum loss

A fully provisioned 238/spl times/238 beam-steering optical crossconnect constructed using surface micromachined mirrors is described. The mean fiber-to-fiber insertion loss of the fabric is 1.33dB and the maximum insertion loss is 2dB.

Optical MEMS devices for telecom systems

As telecom networks increase in complexity there is a need for systems capable of manage numerous optical signals. Many of the channel-manipulation functions can be done more effectively in the optical domain. MEMS devices are especially well suited for this functions since they can offer large number of degrees of freedom in a limited space, thus providing high levels of optical integration. We have designed, fabricated and tested optical MEMS devices at the core of Optical Cross Connects, WDM spectrum equalizers and Optical Add-Drop multiplexors based on different fabrication technologies such as polySi surface micromachining, single crystal SOI and combination of both. We show specific examples of these devices, discussing design trade-offs, fabrication requirements and optical performance in each case.