Markus Kirsch

Housing for an Optoelectronic Component and Arrangement of an Optoelectronic Component in a Housing

Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse

Optoelectronic component producing method, involves providing assembly of semiconductor body to generate electromagnetic radiation, and forming frame circumstantially formed at assembly region on carrier by photo-structure

Optoelectronic Device with Housing Body

Housing body for opto-electronic component, has main surface with surface area and another surface area, and both surface areas are adjoined together by outer edge

Semiconductor light-emitting device has semiconductor chip that emits monochromatic visible light in wavelength region with respect to light decoupling surface, in which transparent matrix material with silicone and filler are formed

Optoelectronic device with a housing body

MONOLITHIC SEMICONDUCTOR CHIP ARRAY

Method for production of arrangement of optoelectronic components, involves manufacturing two attachment areas on connection carrier and bringing soldering material into attachment areas

Optoelektronische Bauelementevorrichtung, Verfahren zum Herstellen einer optoelektronischen Bauelementevorrichtung und Verfahren zum Betreiben einer optoelektronischen Bauelementevorrichtung