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Featured researches published by Masami Kamiya.


Archive | 2004

Composite, prepreg using the same, metallic foil lined laminate, printed wiring substrate and method for manufacturing printed wiring substrate

Masami Kamiya; Mare Takano; 雅己 神谷; 希 高野


Archive | 1988

Radio frequency circuit board

Masami Kamiya; Takao Sugawara; Yutaka Yamaguchi; Mitsuo Yokota; Kenji Tsukanishi


Archive | 2005

Composite, prepreg, metal foil-clad laminated plate, and multilayer printed wiring board and manufacturing method thereof

Masami Kamiya; Mare Takano; 雅己 神谷; 希 高野


Archive | 2004

Composite, prepreg using the same, metal foil-clad laminate plate, circuit board and method for producing the circuit board

Masami Kamiya; Mare Takano; 雅己 神谷; 希 高野


Archive | 1992

METHOD AND DEVICE FOR PRODUCING SHEET

Masami Kamiya; Shinichi Kamoshita; Yoshinori Sato; 義則 佐藤; 雅己 神谷; 真一 鴨志田


Archive | 1991

HIGH FREQUENCY COPPER CLAD LAMINATED BOARD AND PRINTED CIRCUIT BOARD

Masami Kamiya; 雅己 神谷


Archive | 1998

MANUFACTURE OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD MANUFACTURED THEREBY

Masami Kamiya; Masaaki Sunochi; 雅己 神谷; 政明 須之内


Archive | 1991

Laminated board for printed circuit and manufacture thereof

Yasuyuki Aoki; Hidenori Eriguchi; Masami Kamiya; Kenichi Ohori; Mitsuo Yokota; Shunya Yokozawa; 健一 大堀; 舜哉 横澤; 光雄 横田; 秀紀 江里口; 雅己 神谷; 泰幸 青木


Archive | 2005

複合体、これを用いたプリプレグ、金属箔張積層板及び多層印刷配線板並びに多層印刷配線板の製造方法

Masami Kamiya; Mare Takano; 雅己 神谷; 希 高野


Archive | 2005

複合体、プリプレグ、金属箔張積層板、プリント配線板及び多層プリント配線板並びにそれらの製造方法

Masami Kamiya; Mare Takano; 雅己 神谷; 希 高野

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