Masanobu Ishida
Kyocera
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Publication
Featured researches published by Masanobu Ishida.
international symposium on advanced packaging materials processes properties and interfaces | 1999
Masanobu Ishida; T. Hasegawa; T. Iwaida; A. Knudsen
Due to its high thermal conductivity (TC) and a low thermal expansion coefficient, which is comparable to that of Si, aluminum nitride (AlN) has been adopted for packages requiring high thermal dissipation. Kyocera has been conducting research and development on AlN for more than ten years, and has produced many kinds of AlN products, such as Cer-Quad and multilayer packages, in addition to thin film substrates. We have developed a novel low-temperature co-fireable AlN composition (AN75W) to reduce cost. In this paper, we describe the thermal properties of the AN75W material, with a brief description of the general characteristics of packages produced with this ceramic.
Archive | 1999
Koichi Nagata; Kenji Kitazawa; Shinichi Koriyama; Shigeki Morioka; Takanori Kubo; Hidehiro Minamiue; Masanobu Ishida; Akira Nakayama; Naoyuki Shino
Archive | 2007
Masato Fukutome; Masanobu Ishida; Shugo Onizuka; Toshiaki Shigeoka; 政信 石田; 正人 福留; 俊昭 重岡; 修吾 鬼塚
Archive | 2006
Masato Fukudome; Fujito Nakakawaji; Masanobu Ishida; Tsutae Iryou
Archive | 1999
Masanobu Ishida; Shigeki Yamada; Yasuhiko Yoshihara; Masamitsu Onitani
Archive | 1999
Hidehiro Arikawa; Masanobu Ishida; Masamitsu Onitani; Shigeki Yamada; Yasuhiko Yoshihara; 安彦 吉原; 成樹 山田; 秀洋 有川; 政信 石田; 正光 鬼谷
Archive | 1997
Masanobu Ishida; Toshihiro Iwaida; Hiroshi Okayama
Archive | 1997
Masanobu Ishida; Masamitsu Onitani; Shigeki Yamada; Yasuhiko Yoshihara; 安彦 吉原; 成樹 山田; 政信 石田; 正光 鬼谷
Archive | 1998
Toshihiro Iwaida; Teruhisa Makino; Masanobu Ishida; Tomohide Hasegawa; Hirosi Okayama
Archive | 2006
Masanobu Ishida; Fujito Nakakawaji; Shuichi Tateno; 藤人 中川路; 政信 石田; 周一 立野
