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Dive into the research topics where Masao Arima is active.

Publication


Featured researches published by Masao Arima.


Archive | 2016

PHOTOCURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED CIRCUIT BOARD

Nobuhito Itoh; Yoko Shibasaki; Kenji Kato; Masao Arima


Archive | 2008

FLEXIBLE LAMINATE HAVING THERMOPLASTIC POLYIMIDE LAYER AND METHOD FOR MANUFACTURING THE SAME

Takahiro Nishikawa; Masashi Nakano; Noriyuki Akane; Nobuhito Ito; Masaki Sasaki; Masao Arima


Archive | 2012

PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM THEREOF, AND PRINTED WIRING BOARD USING THEM

Nobuhito Ito; Kazuyoshi Yoneda; Masao Arima


Archive | 2010

Curable resin composition, dry membrane and printed circuit board using same

Okamoto Ochi; Yutaka Yokoyama; Kazuyoshi Yoneda; Masao Arima


Archive | 2010

Flame retardant photocurable resin composition, dry film thereof, cured product, and printed wiring board using the same

Masao Arima; Yutaka Yokoyama; Kazuyoshi Yoneda; 聖夫 有馬; 裕 横山; 一善 米田


Archive | 2012

Layered structure and photosensitive dry film to be used therefor

Takahiro Yoshida; Shouji Minegishi; Masao Arima


Archive | 2011

PHOTOCURABLE RESIN COMPOSITION, DRY FILM, CURED ARTICLE AND PRINTED WIRING BOARD

Nobuhito Ito; Daichi Okamoto; Takahiro Yoshida; Masao Arima


Archive | 2010

Resin composition for polyester substrate, and dry film and printed wiring board using the same

Masao Arima; Yutaka Yokoyama; Kazuyoshi Yoneda; 聖夫 有馬; 裕 横山; 一善 米田


Archive | 2007

Photocurable/thermosetting resin composition, cured product and printed wiring board

Nobuhito Itoh; Yoko Shibasaki; Kenji Kato; Masao Arima


Archive | 1999

Liquid thermosetting composition for filler and permanent filling of printed circuit board with the same

Masao Arima; Norio Kimura; Akio Sekimoto; Shiyouji Sugita; Kyoichi Yoda; 恭一 依田; 聖夫 有馬; 紀雄 木村; 昌始 杉田; 晃男 関本

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Kenji Kato

National Institute of Advanced Industrial Science and Technology

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Masaki Sasaki

Japan Aerospace Exploration Agency

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