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Masaru Kiyota

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Publication

Featured researches published by Masaru Kiyota.

Archive | 1999

Formation of electric conductive film on surface of polyimide resin

Masaru Kiyota; Hidemi Nawafune; 優 清田; 秀美 縄舟

Archive | 1993

Direct plating method by metallization of copper oxide (i) colloid

Masaru Kiyota; Takeshi Miura; Hidemi Nawafune; 武之 三浦; 優 清田; 秀美 縄舟

Archive | 2000

ELECTROPLATING METHOD TO SILICON WAFER

Masaru Kiyota; Takeshi Miura; Yasuo Ota; 武之 三浦; 康夫 太田; 優 清田

Archive | 1997

Formation of electoconductive film on polyimide resin surface

Masaru Kiyota; Masaru Kusaka; Takeshi Miura; Hidemi Nawafune; 武之 三浦; 大 日下; 優 清田; 秀美 縄舟

Archive | 2000

Accelerator bath solution for direct plating and direct plating method

Bill Brasch; Henry Garay; Masaaki Imanari; Masaru Kiyota; Yoshihiro Sugita; Hideki Tsuchida; Kieth Waryold; ワーリヨルド キース; ブレッシュ ビル; ギャレイ ヘンリー; 眞明 今成; 秀樹 土田; 芳博 杉田; 優 清田

Archive | 1999

METHOD FOR FILLING COPPER INTO TRENCH OR VIA HOLE OF WAFER BY ELECTROLYTIC-COPPER PLATING

Masaaki Imanari; Masaru Kiyota; 眞明 今成; 優 清田

Archive | 1997

Method for removing harmful heavy metal from liquid absorbent containing harmful heavy metal

Masaru Kiyota; Takeshi Miura; Junya Nishino; Toshiyuki Suzuki; Jujiro Umeda; Tetsuya Watanabe; 武之 三浦; 十次郎 梅田; 優 清田; 哲也 渡辺; 順也 西野; 俊行 鈴木

Archive | 1996

Electrolytic copper plating device using insoluble anode and copper plating method employing the device

Masaru Kiyota; Takeshi Miura; Kazuyuki Suda; 武之 三浦; 優 清田; 和幸 須田

Archive | 1994

FORMATION OF PLATING LAYER ON GLASS OR CERAMIC SUBSTRATE

Masaaki Imanari; Masaru Kiyota; Takeshi Miura; Hidemi Nawafune; 武之 三浦; 眞明 今成; 優 清田; 秀美 縄舟

Archive | 1991

COPPER STRIKING METHOD SUBSTITUTED FOR ELECTROLESS COPPER PLATING

Masaru Kiyota; Takeshi Miura

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Hidemi Nawafune

Konan University

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Junya Nishino

IHI Corporation

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Toshiyuki Suzuki

Nihon University

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Tetsuya Watanabe

Hitachi

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