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Publication
Featured researches published by Masaru Kusaka.
Circuit World | 2003
Mark Lefebvre; George Allardyce; Masaru Seita; Hideki Tsuchida; Masaru Kusaka; Shinjiro Hayashi
This paper describes a copper electroplating enabling technology for filling microvias. Driven by the need for faster, smaller and higher performance communication and electronic devices, sequential build up (SBU) technology has been adopted as a viable multilayer printed circuit manufacturing technology. Increased wiring density, reduced line widths, smaller through‐holes and microvias are all attributes of these high density interconnect (HDI) packages. Filling the microvias with conductive material allows the use of stacked vias and via in pad designs. Other potential design attributes include thermal management enhancement and benefits for high frequency circuitry. Electrodeposited copper can be utilized for filling microvias and provides potential advantages over alternative via plugging techniques. The features, development, scale up and results of direct current (DC) and periodic pulse reverse (PPR) acid copper via filling processes, including chemistry and equipment, are described.
Archive | 2003
Hideki Tsuchida; Masaru Kusaka
Archive | 2002
Hideki Tsuchida; Masaru Kusaka; Shinjiro Hayashi; Satoru Tsukagoshi
Archive | 2003
Hideki Tsuchida; Masaru Kusaka; Shinjiro Hayashi
Archive | 2005
Masaru Seita; Hideki Tsuchida; Masaaki Imanari; Masaru Kusaka; Koichi Yomogida; Hidemi Nawafune; Syozo Mizumoto; Shingo Ikeda
Archive | 1997
Masaru Kiyota; Masaru Kusaka; Takeshi Miura; Hidemi Nawafune; 武之 三浦; 大 日下; 優 清田; 秀美 縄舟
Archive | 2001
Masaru Seita; Hideki Tsuchida; Masaru Kusaka
Archive | 2001
Masaru Seita; Hideki Tsuchida; Masaru Kusaka
Journal of Japan Institute of Electronics Packaging | 1999
Hidemi Nawafune; Taro Nishioka; Haruo Tsuji; Shozo Mizumoto; Masaru Seita; Masaru Kusaka
Archive | 2003
Hideki Tsuchida; Masaru Kusaka; Shinjiro Hayashi
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National Institute of Advanced Industrial Science and Technology
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