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Masayuki Miyairi

Denso

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Publication

Featured researches published by Masayuki Miyairi.

Archive | 2004

METAL PASTE, AND METHOD OF FORMING BUMP ON SEMICONDUCTOR WAFER BY USING THE METAL PASTE

Toshinori Kogashiwa; Masayuki Miyairi; 正幸 宮入; 俊典 小柏

Archive | 1999

Conductive paste composition including conductive metallic powder

Kengo Oka; Takashi Nagasaka; Yuji Ootani; Kazumasa Naito; Masayuki Miyairi

Archive | 2007

METALLIC PASTE FOR SEALING, METHOD FOR AIRTIGHTLY SEALING PIEZOELECTRIC ELEMENT, AND PIEZOELECTRIC DEVICE

Toshinori Kogashiwa; Masayuki Miyairi; Yoji Nagano; 正幸 宮入; 俊典 小柏; 洋二 永野

Archive | 2008

Metal paste for sealing, method for hermetical sealing of piezoelectric element, and piezoelectric device

Toshinori Ogashiwa; Masayuki Miyairi; Yoji Nagano

Archive | 2009

Method of forming through electrode of circuit board

Nobuyuki Akiyama; Toshinori Kogashiwa; Masayuki Miyairi; Takashi Nishimori; 正幸 宮入; 俊典 小柏; 伸之 秋山; 尚 西森

Archive | 2005

BUMP AND ITS FORMATION METHOD

Toshinori Kogashiwa; Masayuki Miyairi; 正幸 宮入; 俊典 小柏

Archive | 1998

Insulation paste compound, conductor paste compound and circuit substrate

Masayuki Miyairi; Takashi Nagasaka; Kazumasa Naito; Kengo Oka; Yuji Otani; 和正 内藤; 祐司 大谷; 正幸 宮入; 賢吾 岡; 長坂 崇

Archive | 2010

BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRATE HAVING THE BUMP THEREON

Toshinori Ogashiwa; Masayuki Miyairi

Archive | 2013

Conductive paste for die bonding, and die bonding method with the conductive paste

Toshinori Ogashiwa; Masayuki Miyairi; Akikazu Shioya

Archive | 2011

NOBLE METAL PASTE FOR BONDING OF SEMICONDUCTOR ELEMENT

Masayuki Miyairi; Nobuyuki Akiyama; Katsuji Inagaki; Toshinori Ogashiwa

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Kazumasa Naito

Denso

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Kengo Oka

Denso

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Takashi Nagasaka

Denso

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Yuji Ootani

Denso

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