Matthew M. Salatino

Lid wafer bond packaging and micromachining

Fingerprint sensor and token reader and associated methods

Integrated circuit device having an opening exposing the integrated circuit die and related methods

Stacked configuration for integrated circuit devices

Fingerprint sensor package having enhanced electrostatic discharge protection and associated methods

Direct chip attachment method

Fingerprint sensor including an anisotropic dielectric coating and associated methods

Finger sensor including enhanced esd protection and associated methods

Fingerprint sensor having enhanced ESD protection and associated methods

Finger sensor including flexible circuit and associated methods