Maximilian Warhanek

Author Correction: Accurate Micro-Tool Manufacturing by Iterative Pulsed-Laser Ablation

The original version of this article unfortunately contained a mistake. The name of the 3rd author on the published version of the article was wrong. With this, the original article was corrected and the correct name of the 3rd author is now presented in here.

Picosecond pulsed laser processing of polycrystalline diamond and cubic boron nitride composite materials

Capabilities and advantages of laser ablation processes utilizing ultrashort pulses have been demonstrated in various applications of scientific and industrial nature. Of particular interest are applications that require high geometrical accuracy, excellent surface integrity and thus tolerate only a negligible heat-affected zone in the processed area. In this context, this work presents a detailed study of the ablation characteristics of common ultrahard composite materials utilized in the cutting tool industry, namely polycrystalline diamond (PCD) and polycrystalline cubic boron nitride composite (PCBN). Due to the high hardness of these materials, conventional mechanical processing is time consuming and costly. Herein, laser ablation is an appealing solution, since no process forces and no wear have to be taken into consideration. However, an industrially viable process requires a detailed understanding of the ablation characteristics of each material. Therefore, the influence of various process parameters on material removal and processing quality at 10 ps pulse duration are investigated for several PCD and PCBN grades. The main focus of this study examines the effect of different laser energy input distributions, such as pulse frequency and burst pulses, on the processing conditions in deep cutting kerfs and the resulting processing speed. Based on these results, recommendations for efficient processing of such materials are derived.

Enabling advanced functionalities of Diamond and other ultra-hard materials by Integrated Pulsed Laser Ablation Technologies

Diamond and other ultra-hard materials possess outstanding mechanical, wear and thermal properties that make them attractive to manufacture a wide range of high value-added products such as highperformance, smart tools. However, due to the extreme properties of this group of materials, e cient and precise generation of complex 3D freeform geometries and structures to meet the needs for a further development of high-performance tools is still a challenge. DIPLAT addresses the need for an e cient, precise and exible processing technology for ultra-hard materials in tooling applications, in order to fully exploit the potential of these materials. By smartly utilizing the advantages of high brilliance short and ultra-short pulsed lasers, a tooling technology based on 3D Pulsed Laser Ablation (PLA) will be developed and demonstrated for various industrial applications. DIPLAT will introduce new technology platform for producing ultra-hard tools with enhanced functionality, outstanding machining performance and superior lift-time. In this regard, DIPLAT fosters the following four main scienti c and technological objectives: (1) Design functional surfaces (with controlled micro geometries) on diamond and other ultra-hard materials to enable enhanced functionality for tooling applications; (2) Study and development of advanced 3D processing strategies for structuring/conditioning of ultra-hard tool surfaces and superabrasive grain layers by Pulsed Laser Ablation; (3) Develop and implement a novel multi-axis control concept and a model-based CAM software support module to enable optimized 3D pulsed laser processing; (4) Grant agreement ID: 314731 Status Closed project DIPLAT