Meixin Feng

Strong photoluminescence of nanostructured crystalline tungsten oxide thin films

Strong photoluminescence (PL) is observed in nanostructured crystalline tungsten oxide thin films that are prepared by thermal evaporation. Two kinds of films are investigated—one made of nanoparticles and another of nanowires. At room temperature, strong PL emissions at ultraviolet-visible and blue regions are found in both of the films. Compared with the complete absence of emission of bulk phase tungsten oxide powder under the same excitation conditions, our results clearly demonstrate the quantum-confinement-effect-induced photoluminescence in nanostructured tungsten oxides.Strong photoluminescence (PL) is observed in nanostructured crystalline tungsten oxide thin films that are prepared by thermal evaporation. Two kinds of films are investigated—one made of nanoparticles and another of nanowires. At room temperature, strong PL emissions at ultraviolet-visible and blue regions are found in both of the films. Compared with the complete absence of emission of bulk phase tungsten oxide powder under the same excitation conditions, our results clearly demonstrate the quantum-confinement-effect-induced photoluminescence in nanostructured tungsten oxides.

Suppression of thermal degradation of InGaN/GaN quantum wells in green laser diode structures during the epitaxial growth

Local InGaN quantum well (QW) decomposition and resultant inhomogeneous luminescence in green laser diode (LD) epitaxial structures are investigated using micro-photoluminescence, Z-contrast scanning transmission electron microscopy, and high-resolution transmission electron microscopy. The local InGaN QW decomposition is found to happen during p-type layer growth due to too high thermal budget and may initiate at the InGaN/GaN QW upper interface probably due to the formation of In-rich InGaN clusters there. Reducing thermal budget and optimizing InGaN/GaN QW growth suppress the local InGaN QW decomposition, and green LD structures with homogeneous luminescence and bright electroluminescence (EL) intensity are obtained.

GaN-on-Si blue/white LEDs: epitaxy, chip, and package*

The dream of epitaxially integrating Ⅲ-nitride semiconductors on large diameter silicon is being fulfilled through the joint R&D efforts of academia and industry, which is driven by the great potential of GaN-on-silicon technology in improving the efficiency yet at a much reduced manufacturing cost for solid state lighting and power electronics. It is very challenging to grow high quality GaN on Si substrates because of the huge mismatch in the coefficient of thermal expansion (CTE) and the large mismatch in lattice constant between GaN and silicon, often causing a micro-crack network and a high density of threading dislocations (TDs) in the GaN film. Al-composition graded AlGaN/AlN buffer layers have been utilized to not only build up a compressive strain during the high temperature growth for compensating the tensile stress generated during the cool down, but also filter out the TDs to achieve crack-free high-quality n-GaN film on Si substrates, with an X-ray rocking curve linewidth below 300 arcsec for both (0002) and (1012) diffractions. Upon the GaN-on-Si templates, prior to the deposition of p-AlGaN and p-GaN layers, high quality InGaN/GaN multiple quantum wells (MQWs) are overgrown with well-engineered V-defects intentionally incorporated to shield the TDs as non-radiative recombination centers and to enhance the hole injection into the MQWs through the via-like structures. The as-grown GaN-on-Si LED wafers are processed into vertical structure thin film LED chips with a reflective p-electrode and the N-face surface roughened after the removal of the epitaxial Si(111) substrates, to enhance the light extraction efficiency. We have commercialized GaN-on-Si LEDs with an average efficacy of 150-160 lm/W for 1 mm 2 LED chips at an injection current of 350 mA, which have passed the 10000-h LM80 reliability test. The as-produced GaN-on-Si LEDs featured with a single-side uniform emission and a nearly Lambertian distribution can adopt the wafer-level phosphor coating procedure, and are suitable for directional lighting, camera flash, streetlighting, automotive headlamps, and otherlighting applications.

Effect of strain on voltage-controlled magnetism in BiFeO3-based heterostructures

Voltage-modulated magnetism in magnetic/BiFeO3 heterostructures can be driven by a combination of the intrinsic ferroelectric-antiferromagnetic coupling in BiFeO3 and the antiferromagnetic-ferromagnetic exchange interaction across the heterointerface. However, ferroelectric BiFeO3 film is also ferroelastic, thus it is possible to generate voltage-induced strain in BiFeO3 that could be applied onto the magnetic layer across the heterointerface and modulate magnetism through magnetoelastic coupling. Here, we investigated, using phase-field simulations, the role of strain in voltage-controlled magnetism for these BiFeO3-based heterostructures. It is predicted, under certain condition, coexistence of strain and exchange interaction will result in a pure voltage-driven 180° magnetization reversal in BiFeO3-based heterostructures.

Design Considerations for GaN-Based Blue Laser Diodes With InGaN Upper Waveguide Layer

Effects of an inserted InGaN interlayer between active region and p-AlGaN electron blocking layer on electrical and optical characteristics of GaN-based blue laser diodes are numerically investigated. It is found that the inserted InGaN interlayer reduces the barrier height for hole injection into multiple quantum wells. Moreover, it is found that the background electron concentration of the undoped InGaN plays a critical role in the LD performance. A background electron concentration higher than 1 × 1017 cm-3 may induce undesired electron-hole recombination in this layer. In addition, we have calculated the dependences of optical confinement factor and internal absorption loss (IAL) on location, In composition, and thickness of the InGaN layer. A significant increase in OCF and a decrease in IAL are obtained by inserting the InGaN layer.

Identification of degradation mechanisms of blue InGaN/GaN laser diodes

A comprehensive analysis of the degradation mechanism of blue InGaN/GaN laser diodes (LDs) is carried out by investigating the electrical and optical characteristics. The increase in the leakage current as well as decrease in the slope efficiency is observed. The luminescence properties of the active region at different aging stages are studied by means of cathodoluminescence. Significant degradation of the active region is observed on the room temperature cathodoluminescence while the low temperature cathodoluminescence shows almost no degradation, indicating that the degradation of the LDs is due to generation of low temperature frozen point defects. Furthermore, the generation of the defects follows a kinetic mechanism enhanced by electron-hole non-radiative recombination which explains the acceleration of time degradation in our LDs.

Hole transport in c-plane InGaN-based green laser diodes

Hole transport in c-plane InGaN-based green laser diodes (LDs) has been investigated by both simulations and experiments. It is found that holes can overflow from the green double quantum wells (DQWs) at high current density, which reduces carrier injection efficiency of c-plane InGaN-based green LDs. A heavily silicon-doped layer right below the green DQWs can effectively suppress hole overflow from the green DQWs.

GaN grown on nano-patterned sapphire substrates*

High-quality gallium nitride (GaN) film was grown on nano-patterned sapphire substrates (NPSS) and investigated using XRD and SEM. It was found that the optimum thickness of the GaN buffer layer on the NPSS is 15 nm, which is thinner than that on micro-patterned sapphire substrates (MPSS). An interesting phenomenon was observed for GaN film grown on NPSS:GaN mainly grows on the trench regions and little grows on the sidewalls of the patterns at the initial growth stage, which is dramatically different from GaN grown on MPSS. In addition, the electrical and optical properties of LEDs grown on NPSS were characterized.

Conductivity enhancement in AlGaN:Mg by suppressing the incorporation of carbon impurity

Growth conditions were explored to suppress the carbon impurity incorporation in AlGaN:Mg grown at low temperatures. Electrical properties of Al0.07Ga0.93N:Mg samples with various carbon concentrations were investigated by Hall measurements. A clear correlation between carbon concentration and electrical conductivity has been found. By reducing the carbon concentration from 2 x 10(18) to 5 x 10(16) cm(-3), the resistivity of p-Al0.07Ga0.93N decreases from 7.4 to 2.2 Omega.cm. From the results of the analysis of the charge neutrality equation, we found that the carbon concentration is close to the compensating donor concentration in the AlGaN:Mg samples, which suggests that carbon acts as the main compensating donor in AlGaN:Mg

High-power AlGaN-based near-ultraviolet light-emitting diodes grown on Si(111)

High-power AlGaN-based 385 nm near-ultraviolet light-emitting diodes (UVA-LEDs) grown on Si(111) substrates are reported. The threading dislocation (TD) density of AlGaN was reduced by employing an Al-composition step-graded AlN/AlGaN multilayer buffer. V-shaped pits were intentionally incorporated into the active region to screen the carriers from the nonradiative recombination centers (NRCs) around the TDs and to facilitate hole injection. The light extraction efficiency was enhanced by the surface roughening of a thin-film (TF) vertical chip structure. The as-fabricated TF-UVA-LED exhibited a light output power of 960 mW at 500 mA, corresponding to an external quantum efficiency of 59.7%.