Melissa D. Boyd
Hewlett-Packard
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Proceedings., 39th Electronic Components Conference | 1989
Melissa D. Boyd
A tape automated bonding (TAB) development project is discussed. In the early stages of the project many tough issues were faced. The choice of tape and bump technologies appropriate for the end users, equipment sourcing, and equipment setup and debugging are discussed. The first customer product, a 104L CMOS chip, was qualified and released to production in early 1988. Since that date, the process has ramped up to production volumes. Data regarding reliability, failure modes, and other key process parameters are presented.<<ETX>>
Archive | 1998
David J. Waller; Timothy E. Beerling; Melissa D. Boyd; James W. Pearson; Marvin G. Wong
Archive | 1998
Melissa D. Boyd; Timothy E. Beerling; Timothy L Weber
Archive | 1993
Melissa D. Boyd
Archive | 1999
David J. Waller; Melissa D. Boyd; John M. Koegler
Archive | 1998
Timothy E. Beerling; Timothy L Weber; Melissa D. Boyd
Archive | 2000
Joseph E. Scheffelin; Melissa D. Boyd; James W. Ring; Mohammad Akhavain; Janis Horvath
Archive | 1996
Melissa D. Boyd; Kenneth L. Christensen; Julie Jo Bostater; Naoto Kawamura
Archive | 2003
David M. Kwasny; Melissa D. Boyd; Lawrence R Plotkin; George C Ross; Emily B. Winston
Archive | 1997
Melissa D. Boyd; Mark H. Kowalski
