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Michael Barrow

Intel

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Publication

Featured researches published by Michael Barrow.

Archive | 1997

Perimeter matrix ball grid array circuit package with a populated center

Michael Barrow

Archive | 1998

Ball grid array integrated circuit package that has vias located within the solder pads of a package

Michael Barrow

Archive | 1999

Custom corner attach heat sink design for a plastic ball grid array integrated circuit package

Michael Barrow

Archive | 1999

Eclipse via in pad structure

Michael Barrow

Archive | 1999

Integrated circuit package substrate with stepped solder mask openings

Michael Barrow

Archive | 1998

Electronics package that has a substrate with an array of hollow vias and solder balls that are eccentrically located on the vias

Behrooz Mehr; Tony Kean-Lee Lim; Agnes Seok-Tuan Lim; Michael Barrow

Archive | 1998

Variable pitch stagger die for optimal density

Michael Barrow

Archive | 2003

Thermal spreading enhancements for motherboards using PBGAs

Michael Barrow

Archive | 1997

Corner heat sink which encloses an integrated circuit of a ball grid array integrated circuit package

Michael Barrow

Archive | 1998

Quad flat pack integrated circuit package

Michael Barrow

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Agnes Seok-Tuan Lim

Intel

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Behrooz Mehr

Intel

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Tony Kean-Lee Lim

Intel

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