Michael Barrow

Perimeter matrix ball grid array circuit package with a populated center

Ball grid array integrated circuit package that has vias located within the solder pads of a package

Custom corner attach heat sink design for a plastic ball grid array integrated circuit package

Eclipse via in pad structure

Integrated circuit package substrate with stepped solder mask openings

Electronics package that has a substrate with an array of hollow vias and solder balls that are eccentrically located on the vias

Variable pitch stagger die for optimal density

Thermal spreading enhancements for motherboards using PBGAs

Corner heat sink which encloses an integrated circuit of a ball grid array integrated circuit package

Quad flat pack integrated circuit package