Michael Grouchko

Triggering the Sintering of Silver Nanoparticles at Room Temperature

A new approach to achieve coalescence and sintering of metallic nanoparticles at room temperature is presented. It was discovered that silver nanoparticles behave as soft particles when they come into contact with oppositely charged polyelectrolytes and undergo a spontaneous coalescence process, even without heating. Utilizing this finding in printing conductive patterns, which are composed of silver nanoparticles, enables achieving high conductivities even at room temperature. Due to the sintering of nanoparticles at room temperature, the formation of conductive patterns on plastic substrates and even on paper is made possible. The resulting high conductivity, 20% of that for bulk silver, enabled fabrication of various devices as demonstrated by inkjet printing of a plastic electroluminescent device.

Copper Nanoparticles for Printed Electronics: Routes Towards Achieving Oxidation Stability

In the past few years, the synthesis of Cu nanoparticles has attracted much attention because of its huge potential for replacing expensive nano silver inks utilized in conductive printing. A major problem in utilizing these copper nanoparticles is their inherent tendency to oxidize in ambient conditions. Recently, there have been several reports presenting various approaches which demonstrate that copper nanoparticles can resist oxidation under ambient conditions, if they are coated by a proper protective layer. This layer may consist of an organic polymer, alkene chains, amorphous carbon or graphenes, or inorganic materials such as silica, or an inert metal. Such coated copper nanoparticles enable achieving high conductivities by direct printing of conductive patterns. These approaches open new possibilities in printed electronics, for example by using copper based inkjet inks to form various devices such as solar cells, Radio Frequency Identification (RFID) tags, and electroluminescence devices. This paper provides a review on the synthesis of copper nanoparticles, mainly by wet chemistry routes, and their utilization in printed electronics.

Plasma and Microwave Flash Sintering of a Tailored Silver Nanoparticle Ink, Yielding 60% Bulk Conductivity on Cost‐Effective Polymer Foils

A combination of plasma and microwave flash sintering is used to sinter an inkjet-printed and tailored silver nanoparticle formulation. By using two sintering techniques sequentially, the obtained conductivity is 60%, while keeping the processing temperature well below the glass transition temperature (T(g)) of the used polymer substrate. This approach leads to highly conductive features on cost-effective polymer substrates in relatively short times, which are compatible with roll-to-roll (R2R) production. An electroluminescence device is prepared as an example.

Conductive patterns on plastic substrates by sequential inkjet printing of silver nanoparticles and electrolyte sintering solutions

A rapid and simple process for obtaining conductive patterns on plastic substrates by inkjet printing of silver nanoparticles is described. The process is based on causing sintering of the silver nanoparticles at low temperature by localized contact with solutions of electrolyte such as NaCl and MgCl2. The contact between the silver particles and the sintering agent is achieved by sequential printing of the two components. High conductivity, above 30% of bulk silver, is achieved by proper control of the type and concentration of the electrolyte and the number of layers of nanoparticles and sintering agent.

Merging of metal nanoparticles driven by selective wettability of silver nanostructures

The welding and sintering of nanomaterials is relevant, for example, to form electrical contacts between metallic particles in printed electronic devices. Usually the welding of nanoparticles is achieved at high temperatures. Here we find that merging of two different metals, silver and gold nanoparticles, occurs on contact at room temperature. The merging process was investigated by experimental and molecular dynamics simulations. We discovered that the merging of these particles is driven by selective wettability of silver nanoparticles, independent of their size and shape (spheres or rods); silver behaves as a soft matter, whereas gold as a hard surface being wetted and retaining its original morphology. During that process, the silver atoms move towards the surface of the Au nanoparticles and wrap the Au nanoparticles in a pulling up-like process, leading to the wetting of Au nanoparticles.

Simulation and prediction of the thermal sintering behavior for a silver nanoparticle ink based on experimental input

In order to develop a prediction model for resistivity evolution during isothermal sintering, a commercial silver nanoparticle ink was characterized for its metal content, particle size and behavior upon heating. Electrical properties, mass loss behavior, grain size development and material densification were studied for thermal sintering at 175 °C. The correlation between mass loss, height loss of the resulting sintered structures, grain size and electrical resistivity was investigated to gain further understanding of the silver nanoparticle sintering process. The results of thermal sintering were used to calibrate a discrete element sintering model that provides microstructural properties with which the resistivity development at 150 and 200 °C was successfully predicted. The model was validated by experimental data obtained at these temperatures. A variation of particle size and particle size distribution in the simulations furthermore illustrate their influence on final resistivity showing that using small particles with a broad distribution are preferable for reducing the final resistivity of the inkjet-printed pattern.