Michael J. Daneman
InvenSense
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Publication
Featured researches published by Michael J. Daneman.
international conference on micro electro mechanical systems | 2016
Xiaoyue Jiang; Hao-Yen Tang; Yipeng Lu; Xi Li; J. M. Tsai; Eldwin J. Ng; Michael J. Daneman; Martin Lim; Fari Assaderaghi; Bernhard E. Boser; David A. Horsley
This paper presents a 591×438 DPI ultrasonic fingerprint sensor. The sensor is based on a piezoelectric micromachined ultrasonic transducer (PMUT) array that is bonded at wafer-level to complementary metal oxide semiconductor (CMOS) signal processing electronics to produce a pulse-echo ultrasonic imager on a chip. To meet the 500 DPI standard for consumer fingerprint sensors, the PMUT pitch was reduced by approximately a factor of two relative to an earlier design. We conducted a systematic design study of the individual PMUT and array to achieve this scaling while maintaining a high fill-factor. The resulting 110×56 PMUT array, composed of 30×43μm2 rectangular PMUTs achieved a 51.7% fill-factor, three times greater than that of the previous design. Together with the custom CMOS ASIC, the sensor achieves 2 μV/Pa sensitivity, 13 kPa pressure output, 75μm lateral resolution, and 150μm axial resolution in a 4.6 mm × 3.2 mm image.
internaltional ultrasonics symposium | 2016
David A. Horsley; Yipeng Lu; Hao-Yen Tang; Xiaoyue Jiang; Bernard E. Boser; J. M. Tsai; Eldwin J. Ng; Michael J. Daneman
This paper describes a single-chip 591×438 DPI ultrasonic fingerprint sensor. The sensor is based on a piezoelectric micromachined ultrasonic transducer (PMUT) array that is bonded at wafer-level to complementary metal oxide semiconductor (CMOS) signal processing electronics to produce a pulse-echo ultrasonic imager on a chip. To meet the 500 DPI standard for consumer fingerprint sensors, the PMUT pitch was reduced by approximately a factor of two relative to an earlier design. We conducted a systematic design study of the individual PMUT design and array to achieve this scaling while maintaining a high fill-factor. The resulting 110×56 PMUT array, composed of rectangular PMUTs achieved a 51.7% fill-factor, three times greater than that of the previous design. Together with the custom CMOS ASIC, the sensor achieves 75 micron lateral resolution and 150 micron axial resolution over a 4.6 mm × 3.2 mm image.
internaltional ultrasonics symposium | 2015
Stephanie Fung; Yipeng Lu; Hao-Yen Tang; J. M. Tsai; Michael J. Daneman; Bernhard E. Boser; David A. Horsley
Ultrasonic imaging for fingerprint applications offers better tolerance of external conditions and high spatial resolution compared to typical optical and solid state sensors respectively. Similar to existing fingerprint sensors, the performance of ultrasonic imagers is sensitive to physical damage. Therefore it is important to understand the theory behind transmission and reflection effects of protective coatings for ultrasonic fingerprint sensors. In this work, we present the analytical theory behind effects of transmitting ultrasound through a thin film of scratch resistant material. Experimental results indicate transmission through 1 μm of Al2O3 is indistinguishable from the non-coated cover substrate. Furthermore, pulse echo measurements of 5 μm thick Al2O3 show ultrasound pressure reflection increases in accordance with both theory and finite element simulation. Consequently, feasibility is demonstrated of ultrasonic transmission through a protective layer with greatly mismatched acoustic impedance when sufficiently thin. This provides a guide for designing sensor protection when using materials of vastly different acoustic impedance values.
Microsystems & Nanoengineering | 2017
Xiaoyue Jiang; Yipeng Lu; Hao-Yen Tang; J. M. Tsai; Eldwin J. Ng; Michael J. Daneman; Bernhard E. Boser; David A. Horsley
This paper presents a 591×438-DPI ultrasonic fingerprint sensor. The sensor is based on a piezoelectric micromachined ultrasonic transducer (PMUT) array that is bonded at wafer-level to complementary metal oxide semiconductor (CMOS) signal processing electronics to produce a pulse-echo ultrasonic imager on a chip. To meet the 500-DPI standard for consumer fingerprint sensors, the PMUT pitch was reduced by approximately a factor of two relative to an earlier design. We conducted a systematic design study of the individual PMUT and array to achieve this scaling while maintaining a high fill-factor. The resulting 110×56-PMUT array, composed of 30×43-μm2 rectangular PMUTs, achieved a 51.7% fill-factor, three times greater than that of the previous design. Together with the custom CMOS ASIC, the sensor achieves 2 mV kPa−1 sensitivity, 15 kPa pressure output, 75 μm lateral resolution, and 150 μm axial resolution in a 4.6 mm×3.2 mm image. To the best of our knowledge, we have demonstrated the first MEMS ultrasonic fingerprint sensor capable of imaging epidermis and sub-surface layer fingerprints.
conference on lasers and electro-optics | 2003
David A. Horsley; Michael J. Daneman; M.R. Hart; K. Hogan; T. Beerling; Behrang Behin; Meng-Hsiung Kiang
This paper presents the design and measured optical performance of a MEMS-based 8/spl times/8-port fiberoptic switch. The device uses a novel two-chip construction to achieve precise MEMS mirror positioning, resulting in insertion loss uniformity within 1 dB and repeatability of less than 0.12 dB. Measurements of six representative 8/spl times/8 switches show a worst-case insertion loss of 2 dB, while typical insertion loss is better than 1.4 dB.
Archive | 2000
Behrang Behin; Michael J. Daneman; Meng-Hsiung Kiang; Kam-Yin Lau; Satinderpall S. Pannu
Archive | 2000
Michael J. Daneman; Behrang Behin; Satinderpall S. Pannu
Archive | 2012
Michael J. Daneman; Martin Lim; Kegang Huang; Igor Tchertkov
Archive | 2000
Behrang Behin; Michael J. Daneman; Meng-Hsiung Kiang; Kam-Yin Lau; Timothy E. Beerling
Archive | 2001
Michael J. Daneman; Behrang Behin; Franklin Wall