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Publication
Featured researches published by Michael Sean June.
intersociety conference on thermal and thermomechanical phenomena in electronic systems | 2002
Michael Sean June; Kamal K. Sikka
For high-power electronic packages, chip hot-spots and cross-chip temperature gradients represent a significant portion of the total thermal resistance from chip to ambient. This paper presents a technique of reducing the chip hot-spot temperatures using cap integral standoffs. The thermal benefit of the standoffs is shown experimentally and validated using thermal modeling. Thermal modeling is then extended to non-uniform power dissipation chips. Results show that the chip hot-spot temperature can be reduced by 5-10 /spl deg/C in a 100 W electronic package.
Archive | 2004
Jimmy G. Foster; Michael Sean June; Albert Vincent Makley; Jason A. Matteson
Archive | 2007
Jimmy G. Foster; Michael Sean June; Vinod Kamath; Beth Frayne Loebach; Albert Vincent Makley; Jason A. Matteson
Archive | 2004
Jimmy G. Foster; Michael Sean June; Albert Vincent Makley; Jason A. Matteson
Archive | 2006
Michael Sean June; Billy Warren Mediin; Mark E. Steinke
Archive | 2005
Patrick A. Coico; David L. Edwards; Benjamin V. Fasano; Lewis S. Goldmann; Ellyn M. Ingalls; Michael Sean June; Hilton T. Toy; Paul A. Zucco
Archive | 2007
Michael Sean June; Robert S. Smith; Troy W. Glover; Whitcomb R. Scott
Archive | 2003
Timothy Samuel Farrow; Michael Sean June; Albert Vincent Makley
Archive | 2007
Jimmy G. Foster; Michael Sean June; Albert Vincent Makley; Jason A. Matteson
Archive | 2010
Michael Sean June; Chunjian Ni; Mark E. Steinke