Michael Tsuk
Ansys
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Publication
Featured researches published by Michael Tsuk.
electrical performance of electronic packaging | 2002
Victor Drabkin; Chris Houghton; Isaac Kantorovich; Michael Tsuk
This paper details a method of determining the worst-case excursion of the voltage in a microprocessor power distribution system, taking into account architectural limitations on variations in required current.
electrical performance of electronic packaging | 2010
Saeed Asgari; Subramanian Lalgudi; Michael Tsuk
Causality of tabulated data is detected by checking for Hilbert-consistency between datas real and imaginary parts. This consistency can be robustly checked if the generalized Hilbert transform is used. Existing algorithms evaluate an integral in this transform numerically. In this paper, a new algorithm for checking causality that involves only analytical integration is presented.
electrical performance of electronic packaging | 2001
Michael Tsuk
For many years, partial inductances have been used in circuit models for signal integrity. However, the authors experience has indicated that partial inductances have more drawbacks than benefits for such work. This paper describes these drawbacks, and proposes a different method of including inductive effects in signal integrity modeling, based on loop inductances. A discussion of the theory and an example are given.
electrical performance of electronic packaging | 2012
Subramanian Lalgudi; Saeed Asgari; Michael Tsuk
Tabulated S-parameters are often tested for causality to ensure successful transient simulation. Existing approaches for this test either are not robust or have limited resolution in detecting noncausality. In this paper, a new approach for this test is proposed. The proposed approach is more robust and has better resolution than existing approaches.
electrical performance of electronic packaging | 2009
Michael Tsuk; Subramanian Lalgudi
The use of the Fast Fourier Transform to generate impulse responses from frequency-domain data is shown to have some pitfalls for transient circuit simulation. A new technique, Least Squares Convolution (LSC), resolves these.
electrical performance of electronic packaging | 2010
Subramanian Lalgudi; Saeed Asgari; Michael Tsuk
Existing delay-based convolution macromodels for S-parameters of electrical interconnects can compromise accuracy. This paper solves this problem by extending the recently-proposed convolution-based macromodeling method called least-squares convolution (LSC) to model propagation delays. The new method is referred to as the delayed LSC (DLSC) method.
SAE International Journal of Commercial Vehicles | 2014
Saeed Asgari; Xiao Hu; Michael Tsuk; Shailendra Kaushik
Archive | 2010
Subramanian Lalgudi; Michael Tsuk
electrical performance of electronic packaging | 2011
Mike Lamson; Michael Tsuk
Archive | 2004
Victor Drabkin; Christopher L Houghton; Isaac Kantorovich; Michael Tsuk