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Dive into the research topics where Michael Tsuk is active.

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Featured researches published by Michael Tsuk.


electrical performance of electronic packaging | 2002

Aperiodic resonant excitation of microprocessor power distribution systems and the reverse pulse technique

Victor Drabkin; Chris Houghton; Isaac Kantorovich; Michael Tsuk

This paper details a method of determining the worst-case excursion of the voltage in a microprocessor power distribution system, taking into account architectural limitations on variations in required current.


electrical performance of electronic packaging | 2010

Analytical integration-based causality checking of tabulated S-parameters

Saeed Asgari; Subramanian Lalgudi; Michael Tsuk

Causality of tabulated data is detected by checking for Hilbert-consistency between datas real and imaginary parts. This consistency can be robustly checked if the generalized Hilbert transform is used. Existing algorithms evaluate an integral in this transform numerically. In this paper, a new algorithm for checking causality that involves only analytical integration is presented.


electrical performance of electronic packaging | 2001

The use of loop inductances in signal integrity modeling

Michael Tsuk

For many years, partial inductances have been used in circuit models for signal integrity. However, the authors experience has indicated that partial inductances have more drawbacks than benefits for such work. This paper describes these drawbacks, and proposes a different method of including inductive effects in signal integrity modeling, based on loop inductances. A discussion of the theory and an example are given.


electrical performance of electronic packaging | 2012

Improved procedure to test causality of tabulated S-parameters

Subramanian Lalgudi; Saeed Asgari; Michael Tsuk

Tabulated S-parameters are often tested for causality to ensure successful transient simulation. Existing approaches for this test either are not robust or have limited resolution in detecting noncausality. In this paper, a new approach for this test is proposed. The proposed approach is more robust and has better resolution than existing approaches.


electrical performance of electronic packaging | 2009

Least squares convolution: A method to improve the fidelity of convolution in transient circuit simulation

Michael Tsuk; Subramanian Lalgudi

The use of the Fast Fourier Transform to generate impulse responses from frequency-domain data is shown to have some pitfalls for transient circuit simulation. A new technique, Least Squares Convolution (LSC), resolves these.


electrical performance of electronic packaging | 2010

Accurate delay-based convolution macromodel using delayed least-squares convolution

Subramanian Lalgudi; Saeed Asgari; Michael Tsuk

Existing delay-based convolution macromodels for S-parameters of electrical interconnects can compromise accuracy. This paper solves this problem by extending the recently-proposed convolution-based macromodeling method called least-squares convolution (LSC) to model propagation delays. The new method is referred to as the delayed LSC (DLSC) method.


SAE International Journal of Commercial Vehicles | 2014

Application of POD plus LTI ROM to Battery Thermal Modeling: SISO Case

Saeed Asgari; Xiao Hu; Michael Tsuk; Shailendra Kaushik


Archive | 2010

Transmission-line simulators and methods

Subramanian Lalgudi; Michael Tsuk


electrical performance of electronic packaging | 2011

Advanced simulation methodologies for SI analysis (T-IX)

Mike Lamson; Michael Tsuk


Archive | 2004

System and method of system response testing and modeling

Victor Drabkin; Christopher L Houghton; Isaac Kantorovich; Michael Tsuk

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