Michael Wayne Quillen

Optimizing Surface Finishing Processes Through the Use of Novel Solvents and Systems

As the semiconductor industry continues to implement the ITRS (International Technology Roadmap for Semiconductors) node targets that go beyond 45nm [1], the need for improved cleanliness between repeated process steps continues to grow. Wafer cleaning challenges cover many applications such as Cu/low-K integration, where trade-offs must be made between dielectric damage and residue by plasma etching and CMP or moisture uptake by aqueous cleaning products. [2-5] Some surface sensitive processes use the Marangoni tool design [6] where a conventional solvent such as IPA (isopropanol), combines with water to provide improved physical properties such as reduced contact angle and surface tension. This paper introduces the use of alternative solvents and their mixtures compared to pure IPA in removing ionics, moisture, and particles using immersion bench-chemistry models of various processes. A novel Eastman proprietary solvent, Eastman methyl acetate is observed to provide improvement in ionic, moisture capture, and particle removal, as compared to conventional IPA. [7] These benefits may be improved relative to pure IPA, simply by the addition of various additives. Some physical properties of the mixtures were found to be relatively unchanged even as measured performance improved. This report presents our attempts to cite and optimize these benefits through the use of laboratory models.