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Featured researches published by Michiharu Honda.


Archive | 1990

Semiconductor stacked device

Toshio Sugano; Kohji Nagaoka; Seiichiro Tsukui; Yoshiaki Wakashima; Michio Tanimoto; Masayuki Watanabe; Suguru Sakaguchi; Kunihiko Nishi; Aizo Kaneda; Kohji Serizawa; Michiharu Honda; Tohru Yoshida; Takeshi Komaru; Atsushi Nakamura


Archive | 1993

Stacked semiconductor memory device and semiconductor memory module containing the same

Toshio Sugano; Kohji Nagaoka; Seiichiro Tsukui; Yoshiaki Wakashima; Michio Tanimoto; Masayuki Watanabe; Suguru Sakaguchi; Kunihiko Nishi; Aizo Kaneda; Kohji Serizawa; Michiharu Honda; Tohru Yoshida; Takeshi Komaru; Atsushi Nakamura


Archive | 1988

Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices

Toshio Sugano; Kohji Nagaoka; Seiichiro Tsukui; Yoshiaki Wakashima; Michio Tanimoto; Masayuki Watanabe; Suguru Sakaguchi; Kunihiko Nishi; Aizo Kaneda; Kohji Serizawa; Michiharu Honda; Tohru Yoshida; Takeshi Komaru; Atsushi Nakamura


Archive | 1997

Bump forming method and apparatus therefor

Kosuke Inoue; Takamichi Suzuki; Hitoshi Odashima; Katsuhiro Iwashita; Tatsuya Yoneda; Michiharu Honda; Katuhisa Tanaka; Tsuyoshi Yamaguchi; Tetsuo Murakami; Asahi Tsuchiya; Yoshitatsu Naito; Mitsuhiro Suzuki; Izumi Hata; Kouji Sajiki


Archive | 1997

Semiconductor device having a ball grid array package structure using a supporting frame

Shigeharu Tsunoda; Junichi Saeki; Isamu Yoshida; Kazuya Ooji; Michiharu Honda; Makoto Kitano; Nae Yoneda; Shuji Eguchi; Kunihiko Nishi; Ichiro Anjoh; Kenichi Otsuka


Archive | 1994

Method of forming solder bump

Michiharu Honda; Hiroshi Honma; Kosuke Inoue; Tomohiko Murase; Hitoshi Odajima; Tomoaki Sakata; Takamichi Suzuki; Katsuhisa Tanaka; 康介 井上; 智昭 坂田; 均 小田島; 美智晴 本田; 博 本間; 友彦 村瀬; 勝久 田中; 高道 鈴木


Archive | 1998

Semiconductor device-mounted on a printed circuit board having solder bumps with excellent connection reliability

Makoto Kitano; Michiharu Honda


Archive | 2000

Semiconductor device-mounting construction and inspection method therefor

Makoto Kitano; Michiharu Honda


Transactions of the Japan Society of Mechanical Engineers. A | 1996

A Method of Determining Reliability Testing Conditions for Solder Joints of Electronic Devices.

Makoto Kitano; Tetsuo Kumazawa; Michiharu Honda; Kazuo Hirota


Archive | 1992

Tape carrier package for soldering multipin chip to substrate by hf heating - comprises base film with device hose, leads having lead sections extending outwardly for bonding to substrate and lead sections extending into device hole

Kokichi Aomori; Michiharu Honda; Toshihiro Okabe

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