Mika Prunnila

Reduction of the thermal conductivity in free-standing silicon nano-membranes investigated by non-invasive Raman thermometry

We report on the reduction of the thermal conductivity in ultra-thin suspended Si membranes with high crystalline quality. A series of membranes with thicknesses ranging from 9 nm to 1.5 μm was investigated using Raman thermometry, a novel contactless technique for thermal conductivity determination. A systematic decrease in the thermal conductivity was observed as reducing the thickness, which is explained using the Fuchs-Sondheimer model through the influence of phonon boundary scattering at the surfaces. The thermal conductivity of the thinnest membrane with d = 9 nm resulted in (9 ± 2) W/mK, thus approaching the amorphous limit but still maintaining a high crystalline quality.

Lifetimes of Confined Acoustic Phonons in Ultrathin Silicon Membranes

We study the relaxation of coherent acoustic phonon modes with frequencies up to 500 GHz in ultrathin free-standing silicon membranes. Using an ultrafast pump-probe technique of asynchronous optical sampling, we observe that the decay time of the first-order dilatational mode decreases significantly from ~4.7 ns to 5 ps with decreasing membrane thickness from ~194 to 8 nm. The experimental results are compared with theories considering both intrinsic phonon-phonon interactions and extrinsic surface roughness scattering including a wavelength-dependent specularity. Our results provide insight to understand some of the limits of nanomechanical resonators and thermal transport in nanostructures.

Phonons in slow motion: dispersion relations in ultrathin Si membranes.

We report the changes in dispersion relations of hypersonic acoustic phonons in free-standing silicon membranes as thin as ∼8 nm. We observe a reduction of the phase and group velocities of the fundamental flexural mode by more than 1 order of magnitude compared to bulk values. The modification of the dispersion relation in nanostructures has important consequences for noise control in nano- and microelectromechanical systems (MEMS/NEMS) as well as opto-mechanical devices.

Tuning thermal transport in ultrathin silicon membranes by surface nanoscale engineering

A detailed understanding of the connections of fabrication and processing to structural and thermal properties of low-dimensional nanostructures is essential to design materials and devices for phononics, nanoscale thermal management, and thermoelectric applications. Silicon provides an ideal platform to study the relations between structure and heat transport since its thermal conductivity can be tuned over 2 orders of magnitude by nanostructuring. Combining realistic atomistic modeling and experiments, we unravel the origin of the thermal conductivity reduction in ultrathin suspended silicon membranes, down to a thickness of 4 nm. Heat transport is mostly controlled by surface scattering: rough layers of native oxide at surfaces limit the mean free path of thermal phonons below 100 nm. Removing the oxide layers by chemical processing allows us to tune the thermal conductivity over 1 order of magnitude. Our results guide materials design for future phononic applications, setting the length scale at which nanostructuring affects thermal phonons most effectively.

Ultra-thin free-standing single crystalline silicon membranes with strain control

We report on fabrication and characterization of ultra-thin suspended single crystalline flat silicon membranes with thickness down to 6 nm. We have developed a method to control the strain in the membranes by adding a strain compensating frame on the silicon membrane perimeter to avoid buckling after the release. We show that by changing the properties of the frame the strain of the membrane can be tuned in controlled manner. Consequently, both the mechanical properties and the band structure can be engineered, and the resulting membranes provide a unique laboratory to study low-dimensional electronic, photonic, and phononic phenomena.

Diffusion-emission theory of photon enhanced thermionic emission solar energy harvesters

Numerical and semi-analytical models are presented for photon-enhanced-thermionic-emission (PETE) devices. The models take diffusion of electrons, inhomogeneous photogeneration, and bulk and surface recombination into account. The efficiencies of PETE devices with silicon cathodes are calculated. Our model predicts significantly different electron affinity and temperature dependence for the device than the earlier model based on a rate-equation description of the cathode. We show that surface recombination can reduce the efficiency below 10% at the cathode temperature of 800 K and the concentration of 1000 suns, but operating the device at high injection levels can increase the efficiency to 15%.

Efficient electronic cooling in heavily doped silicon by quasiparticle tunneling

Cooling of electrons in a heavily doped silicon by quasiparticle tunneling using a superconductor–semiconductor–superconductor double-Schottky-junction structure is demonstrated at low temperatures. In this work, we use Al as the superconductor and thin silicon-on-insulator (SOI) film as the semiconductor. The electron–phonon coupling is measured for the SOI film and the low value of the coupling is shown to be the origin of the observed significant cooling effect.

Simulation and Modeling of Self-switching Devices

A new type of nanometer scale nonlinear device, called self-switching device (SSD) is realized by tailoring the boundary of a narrow semiconductor channel to break its symmetry. An applied voltage V not only changes the potential profile along the channel direction, but also either widens or narrows the effective channel width depending on the sign of V. This results in a strongly nonlinear I-V characteristic, resembling that of a conventional diode. Because the structure resembles a diode-connected FET (gate and drain shorted), we have modeled the device as a sideways turned FET, so that the trench width t corresponds to insulator thickness tox and conducting layer thickness Z (inside the semiconductor!) corresponds to channel width W.

Determination of doping and temperature-dependent elastic constants of degenerately doped silicon from MEMS resonators

Elastic constants c₁₁, c₁₂, and c₄₄ of degenerately doped silicon are studied experimentally as a function of the doping level and temperature. First-and second-order temperature coefficients of the elastic constants are extracted from measured resonance frequencies of a set of MEMS resonators fabricated on seven different wafers doped with phosphorus (carrier concentrations 4.1, 4.7, and 7.5 × 10¹⁹ cm^-3), arsenic (1.7 and 2.5 × 10¹⁹ cm^-3), or boron (0.6 and 3 × 10¹⁹ cm^-3). Measurements cover a temperature range from -40°C to +85°C. It is found that the linear temperature coefficient of the shear elastic parameter c₁₁ - c₁₂ is zero at n-type doping level of n ~ 2 × 10¹⁹ cm^-3, and that it increases to more than 40 ppm/K with increasing doping. This observation implies that the frequency of many types of resonance modes, including extensional bulk modes and flexural modes, can be temperature compensated to first order. The second-order temperature coefficient of c₁₁ - c₁₂ is found to decrease by 40% in magnitude when n-type doping is increased from 4.1 to 7.5 × 10¹⁹ cm^-3. Results of this study enable calculation of the frequency drift of an arbitrary silicon resonator design with an accuracy of ±25 ppm between the calculated and real(ized) values over T = -40°C to +85°C at the doping levels covered in this work. Absolute frequency can be estimated with an accuracy of ±1000 ppm.

Graphene biosensor programming with genetically engineered fusion protein monolayers

We demonstrate a label-free biosensor concept based on specific receptor modules, which provide immobilization and selectivity to the desired analyte molecules, and on charge sensing with a graphene field effect transistor. The receptor modules are fusion proteins in which small hydrophobin proteins act as the anchor to immobilize the receptor moiety. The functionalization of the graphene sensor is a single-step process based on directed self-assembly of the receptor modules on a hydrophobic surface. The modules are produced separately in fungi or plants and purified before use. The modules form a dense and well-oriented monolayer on the graphene transistor channel and the receptor module monolayer can be removed, and a new module monolayer with a different selectivity can be assembled in situ. The receptor module monolayers survive drying, showing that the functionalized devices can be stored and have a reasonable shelf life. The sensor is tested with small charged peptides and large immunoglobulin molecules. The measured sensitivities are in the femtomolar range, and the response is relatively fast, of the order of one second.