MinYoung Shon

Galvanic corrosion of Cu coupled to Au on a print circuit board; Effects of pretreatment solution and etchant concentration in organic solderability preservatives soft etching solution

In present study, we quantitatively define the galvanic corrosion phenomenon of Cu electrically coupled to Au on Print Circuit Board in Organic Solderability Preservatives (OSP) pretreatment (pickling and soft etching) solutions. As a result of polarization and ZRA test, galvanic corrosion rate of Cu in soft etching solution was about 3000 times higher than that of pickling solution. The oxone in OSP soft etching solution was acted as strong oxidant for Cu on PCB substrate. And the galvanic corrosion of Cu in OSP soft etching solution was examined with the change of etchants (oxone (KHSO5), sulfuric acid (H2SO4)) concentration. The galvanic corrosion rate of Cu was increased by the increase of the oxone and sulfuric acid concentrations, which lead to the increase of cathodic reactant such as HSO5- and H+ ions. And the degree of galvanic corrosion rate of Cu (Δisoft etching = icouple, (Cu-Au) - icorr, Cu) decreased with the decrease of the oxone and sulfuric acid concentrations.

Ag-exchanged NaY zeolite introduced polyvinyl alcohol/polyacrylic acid mixed matrix membrane for pervaporation separation of water/isopropanol mixture

Ag-exchanged NaY zeolite (Ag-NaZ) particles were prepared by ion exchange and introduced to a polyvinyl alcohol (PVA) membrane cross-linked with polyacrylic acid (PAA) for the pervaporation dehydration of an isopropanol (IPA) aqueous mixture. The Ag-exchanged NaY zeolite particles were characterized by FE-SEM, EDS, BET, and XRD studies. The prepared Ag-NaZ-loaded PVA/PAA composite membrane was characterized by FE-SEM, XRD, a swelling study, and contact angle measurements. Pervaporation characteristics were investigated in terms of Ag-NaZ concentrations within PVA/PAA membranes using diverse feed solution conditions. The preferential sorption of IPA/water mixtures for Ag-NaZ-introduced membranes were also determined by calculating the apparent activation energies of IPA and water permeation, respectively. As a result, flux and selectivity increased with the Ag-NaZ concentration to 5 wt% in the membrane. Optimum pervaporation performance was observed in a 5 wt% Ag-NaZ-incorporated membrane with a flux equal to 0.084 kg m−2 h−1 and a separation factor of 2717.9 at 40 °C from an 80 wt% IPA aqueous feed solution.

Galvanic corrosion behaviors of Cu connected to Au on a printed circuit board in ammonia solution

During etching treatments of printed circuit board (PCB) with ammnioa solution, galvanic corrosion occurs between electrically connected gold and copper, and resulting in unexpected over-etching problems. Herein, we determine corrosion of galvanic coupled Cu to Au quantitatively in ammonia solutions, and evaluate factors influencing corrosion of galvanic coupled Cu to Au (i.e., area ratio of anode to cathode and stirring speed). The difference of the corrosion rate (Δi = icouple, (Cu-Au)–icorr, Cu) of Cu connected to Au (117 μA/cm2) and of single Cu (86 μA/cm2) infers the amount of over-etching of Cu resulting from galvanic corrosion in ammonia solution (Δi = 0.31 μA/cm2). As the stirring speed increases from 0 to 400 rpm, the corrosion rate of galvanic coupled Cu to Au increases from 36 to 191 μA/cm2. Furthermore, we confirm that an increase in the area ratio (Au/Cu) from 0.5 to 25 results in a higher rate of corrosion of Cu connected to Au. The corrosion rate of galvanic coupled Cu to Au is approximately 20 times higher when the area ratio of Au to Cu is 25 (1360 μA/cm2) than when the ratio is 0.5 (67 μA/cm2).

Mechanical and Thermal Properties of Epoxy Composites Containing Zirconia-Impregnated Halloysite Nanotubes with Different Loadings

Epoxy resins are widely used in various industrial fields due to their low cost, good workability, heat resistance, and good mechanical strength. However, they suffer from brittleness, an issue that must be addressed for further applications. To solve this problem, additional fillers are needed to improve the mechanical and thermal properties of the resins; zirconia is one such filler. However, it has been reported that aggregation may occur in the epoxy composites as the amount of zirconia increases, preventing enhancement of the mechanical strength of the epoxy composites. Herein, to reduce the aggregation, zirconia was well dispersed on halloysite nanotubes (HNTs), which have high thermal and mechanical strength, by a conventional wet impregnation method. The HNTs were impregnated with zirconia at different loadings using zirconyl chloride octahydrate as a precursor. The mechanical and thermal strengths of the epoxy composites with these fillers were investigated. The zirconia-impregnated HNTs (Zr/HNT) were characterized by X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), and tunneling electron microscopy (TEM). The hardening conditions of the epoxy composites were analyzed by differential scanning calorimetry (DSC). The thermal strength of the epoxy composites was studied by thermomechanical analysis (TMA) and micro-calorimetry and the mechanical strength of the epoxy composites (flexural strength and tensile strength) was studied by using a universal testing machine (UTM). The mechanical and thermal strengths of the epoxy composites with Zr/HNT were improved compared to those of the epoxy composite with HNT, and also increased as the zirconia loading on HNT increased.

Induction heating of adhesive for shoe manufacturing

This paper describes the induction heating of adhesive containing conductive fine particles for shoe assembly. The particles are heated on the principle of induction heating to increase the adhesive temperature. To do this, a 5kW induction heater is constructed and several experiments are conducted to design working coil. Finite Element Analysis is also conducted and the analytical and experimental results are compared to find optimal coil shape. From this study, we can develop a prototype of the induction heater for shoe manufacturing.