Mitsuaki Nishie

Small form factor pluggable optical transceiver module with extremely low power consumption for dense wavelength division multiplexing applications

An optical transceiver module for the dense wavelength-division-multiplexing (DWDM) applications is successfully realized with so-called small form factor pluggable (SFP) platform that is well known as the smallest platform for 2.5.Gbps optical transceiver. The power consumption of DWDM-SFP modules we developed is reduced drastically, and that is 1.0 W maximum at the operating case temperature (Tc) range of -5 to 70 degC (for typical DWDM-SFP samples). This remarkable low power consumption is achieved by next three techniques which are a compact coaxial transmitter optical sub assembly (TOSA) package with a micro thermoelectric cooler (micro-TEC), a transceiver IC chip with many functions integrated therein and an unique structure which the TOSA is isolated from other heat sources.

Low power consumption molded gigabit fiberoptic transceiver module

The standardization task of gigabit Ethernet by IEEE802.3z working group is attracting a great deal of attention. The demands for the modules compliant with the standardized specification will be increased. We have successfully developed gigabit fiberoptic transceiver modules compliant with 1000BASE-LX, proposed specification in gigabit Ethernet. The main feature of this module is 3.3 V operation which leads to low power consumption, while most of the conventional modules operate at 5.0 V. We used the newly designed package with lower profile 9.4 mm in height. The carefully designed modules package was formed by transfer mold encapsulation techniques which contribute to the cost reduction. In this paper, the design, assembling process, and characteristics of the developed module are described.