Mitsuhiro Hakozaki
University of Tokyo
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Publication
Featured researches published by Mitsuhiro Hakozaki.
international conference on robotics and automation | 2002
Mitsuhiro Hakozaki; Hiroyuki Shinoda
In this paper, we propose a tactile sensing element that communicates through two dimensional conductive skin layers without individual wires. Each tactile element has sensors and signal processors, and it broadcasts coded tactile signals through a couple of conductive layers. Since the conductive layers can be used for both the electrical power supply and the communication, simply sandwiching the chips between the layers completes electrical connection of tactile sensing chips. Since no metal wires exist, the skin is elastic and tough. High-resolution sensor skins can be easily fabricated in various shapes. In addition, because the tactile elements transmit the locally detected stress data with coded signals, we can obtain high-SN-ratio data from a very small sensing element put at a remote location. This paper describes the skin structure, the communication architecture, the structure of the sensing chip, and the results of basic experiments.
international conference on robotics and automation | 1999
Mitsuhiro Hakozaki; Hideki Oasa; Hiroyuki Shinoda
Human-friendly robots of new generation will require sensor skin that is soft and covering the whole body. But it would be very difficult to fabricate it with the traditional technology, because placement and wiring of a vast amount of sensor elements on the 3-dimensionally configured robot surface is laborious. We propose a novel method to fabricate such a sensor skin. The skin contains sensor chips which receive the electrical power and transmit the tactile signal without wires. The skin is configured in an arbitrary shape easily, and it is elastic and tough because each sensing element does not need any fragile wires. The principle and the experimental results are described.
international conference on robotics and automation | 2004
Hiroyuki Shinoda; Naoya Asamura; Tachio Yuasa; Mitsuhiro Hakozaki; Xinyu Wang; Hiroto Itai; Yastoshi Makino; Akimasa Okada
A two-dimensional communication device proposed in a recent paper is a device in which signals travel freely between arbitrary points in flexible two-dimensional space using two-dimensionally-spread electromagnetic field. The new form of communication solves the wiring problems in various situations. It also has advantages over wireless communication. It consumes less energy for signal transmission, it can provide energy for the connected elements, and the communication capacity is larger because multiple 1D signal chains transmit signals simultaneously. In this paper, we demonstrate examples of high-speed signal transmission through flexible 2D layers with proximity interfaces.
Archive | 2001
Mitsuhiro Hakozaki; Atsushi Hatori; Hiroyuki Shinoda
international conference on robotics and automation | 2003
Hiroyuki Shinoda; Naoya Asamura; Mitsuhiro Hakozaki; Xinyu Wang
Archive | 1999
Mitsuhiro Hakozaki; Katsuhiko Nakamura; Hiroyuki Shinoda
Archive | 2004
Hiroyuki Shinoda; Mitsuhiro Hakozaki; Xinyu Wang; Naoya Asamura
Archive | 2002
Hiroyuki Shinoda; Mitsuhiro Hakozaki; Xinyu Wang; Naoya Asamura
Archive | 2001
Mitsuhiro Hakozaki; Hiroyuki Shinoda; 光弘 箱崎; 裕之 篠田
Archive | 2002
Naoya Asamura; Mitsuhiro Hakozaki; Hiroyuki My Castle Mizonokuchi Vil. Shinoda; Xinyu Wang