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Dive into the research topics where Mitsuhiro Hakozaki is active.

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Featured researches published by Mitsuhiro Hakozaki.


international conference on robotics and automation | 2002

Digital tactile sensing elements communicating through conductive skin layers

Mitsuhiro Hakozaki; Hiroyuki Shinoda

In this paper, we propose a tactile sensing element that communicates through two dimensional conductive skin layers without individual wires. Each tactile element has sensors and signal processors, and it broadcasts coded tactile signals through a couple of conductive layers. Since the conductive layers can be used for both the electrical power supply and the communication, simply sandwiching the chips between the layers completes electrical connection of tactile sensing chips. Since no metal wires exist, the skin is elastic and tough. High-resolution sensor skins can be easily fabricated in various shapes. In addition, because the tactile elements transmit the locally detected stress data with coded signals, we can obtain high-SN-ratio data from a very small sensing element put at a remote location. This paper describes the skin structure, the communication architecture, the structure of the sensing chip, and the results of basic experiments.


international conference on robotics and automation | 1999

Telemetric robot skin

Mitsuhiro Hakozaki; Hideki Oasa; Hiroyuki Shinoda

Human-friendly robots of new generation will require sensor skin that is soft and covering the whole body. But it would be very difficult to fabricate it with the traditional technology, because placement and wiring of a vast amount of sensor elements on the 3-dimensionally configured robot surface is laborious. We propose a novel method to fabricate such a sensor skin. The skin contains sensor chips which receive the electrical power and transmit the tactile signal without wires. The skin is configured in an arbitrary shape easily, and it is elastic and tough because each sensing element does not need any fragile wires. The principle and the experimental results are described.


international conference on robotics and automation | 2004

Two-dimensional communication technology inspired by robot skin

Hiroyuki Shinoda; Naoya Asamura; Tachio Yuasa; Mitsuhiro Hakozaki; Xinyu Wang; Hiroto Itai; Yastoshi Makino; Akimasa Okada

A two-dimensional communication device proposed in a recent paper is a device in which signals travel freely between arbitrary points in flexible two-dimensional space using two-dimensionally-spread electromagnetic field. The new form of communication solves the wiring problems in various situations. It also has advantages over wireless communication. It consumes less energy for signal transmission, it can provide energy for the connected elements, and the communication capacity is larger because multiple 1D signal chains transmit signals simultaneously. In this paper, we demonstrate examples of high-speed signal transmission through flexible 2D layers with proximity interfaces.


Archive | 2001

A Sensitive Skin Using Wireless Tactile Sensing Elements

Mitsuhiro Hakozaki; Atsushi Hatori; Hiroyuki Shinoda


international conference on robotics and automation | 2003

Two-dimensional signal transmission technology for robotics

Hiroyuki Shinoda; Naoya Asamura; Mitsuhiro Hakozaki; Xinyu Wang


Archive | 1999

Telemetric Artificial Skin for Soft Robot

Mitsuhiro Hakozaki; Katsuhiko Nakamura; Hiroyuki Shinoda


Archive | 2004

Communication apparatus, communication device, method for circuit board implementation, and tactile sensor

Hiroyuki Shinoda; Mitsuhiro Hakozaki; Xinyu Wang; Naoya Asamura


Archive | 2002

Communication apparatus, communication device, substrate mounting method, and touch sensor

Hiroyuki Shinoda; Mitsuhiro Hakozaki; Xinyu Wang; Naoya Asamura


Archive | 2001

Tactile sensation detecting system

Mitsuhiro Hakozaki; Hiroyuki Shinoda; 光弘 箱崎; 裕之 篠田


Archive | 2002

COMMUNICATION APPARATUSc COMMUNICATION DEVICEc SUBSTRATE MOUNTING METHODc AND TOUCH SENSOR

Naoya Asamura; Mitsuhiro Hakozaki; Hiroyuki My Castle Mizonokuchi Vil. Shinoda; Xinyu Wang

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Atsushi Hatori

Tokyo University of Agriculture and Technology

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Hideki Oasa

Tokyo University of Agriculture and Technology

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Katsuhiko Nakamura

Tokyo University of Agriculture and Technology

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