Moinul Bhuiyan

Novel design of a self powered and self sensing magneto-rheological damper

Magneto-rheological (MR) dampers are semi-active control devices and use MR fluids. Magneto-rheological dampers have successful applications in mechatronics engineering, civil engineering and numerous areas of engineering. At present, traditional MR damper systems, require a isolated power supply and dynamic sensor. This paper presents the achievability and accuracy of a self- powered and self-sensing magneto-rheological damper using harvested energy from the vibration and shock environment in which it is deployed and another important part of this paper is the increased yield stress of the Magneto rheological Fluids. Magneto rheological fluids using replacement of glass beads for Magnetic Particles to surge yield stress is implemented here. Clearly this shows better result on yield stress, viscosity, and settling rate. Also permanent magnet generator (PMG) is designed and attached to a MR damper. For evaluating the self-powered MR dampers vibration mitigating capacity, an Engine Mount System using the MR damper is simulated. The ideal stiffness of the PMG for the Engine Mount System (EMS) is calculated by numerical study. The vibration mitigating performance of the EMS employing the self-powered & self sensing MR damper is theoretically calculated and evaluated in the frequency domain.

Development of an Advanced Semi-Active Damper Using Smart Fluid

In this paper an advanced semi-active damper is designed and experimentally studied to investigate and establish its behavior. A prototype Magneto-rheological fluid Damper is designed as advanced semi-active damper due to its huge advantages. Magneto-rheological fluid with improved dispersion stability is prepared here as smart fluid. The relation between force and displacement for various current has been established to develop the semi-active damper model. In this study a fuzzy tuned PID controller is opted to achieve better response for a various frequency input. The proposed MR damper can be applied to vehicle syspension system and other suspension mitigation system widely. Moreover, the identified behaviour can help in further development of MR damper technology. The characteristics obtained from of MR damper is more realistic as it is obtained from experiments.

MEMS and EFF technology based micro connector for future miniature devices

The development of a miniature; size, light and high performance electronic devices; has been accelerated for further development. In commercial stamping method, connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the stamped contact hertz stress becomes lower and less suitable for fine pitch connector. To overcome this pitch size problem a narrow pitch Board-to-Board (BtoB) interface connectors are in demand for the current commercial design. Therefore, this paper describes a fork type micro connector design with high Hertz-Stress using MEMS and Electro Fine Forming (EFF) fabrication techniques. The connector is designed high aspect ratio and high-density packaging using UV thick resist and electroforming. In this study a newly fabricated micro connectors maximum aspect ratio is 50μm and pitch is 80μm is designed successfully which is most compact fork-type connector in the world. When these connectors are connected, a contact resistance of less than 50mΩ has been attained by using four-point probe technique.

Development of a high hertz-stress contact for conventional batch production using a unique scribing technology

Gradually the electronic devices are getting more compact dimension with respect to the width and thickness. As a result, the contacts are becoming thinner and which leads the contact to be loose and unstable contact. In comercial stamping methode, connector tip diameter should be more than 300μm due to its size limitation. Consequently, the connector contact resistance is becoming higher due to weak contact force. To overcome this problem there were few more basic research using MEMS and Electro Fine Forming (EFF) technology to make high Hertz-Stress Contact (5μm) due to the limitation in the commercial stamping process and the result was in satisfactory level. However, since the MEMS and EFF fabrication is costly therefore, a new method is introduced in this paper using the commercial Phosphor Bronze stamping method to reduce the production cost. Moreover, scribing method is used to make tip on the contact. Accordingly, more compact fine pitch contact is successfully fabricated and tested with 5μm High Hertz Stress without using the MEMS and EFF technology. Hence the manufactured contact resistance becomes less than 20mΩ ±5mΩ.