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Featured researches published by Morio Gaku.


electrical electronics insulation conference | 1977

Characteristics and application of Triazine resins

Morio Gaku; Kazuhiro Suzuki; Nobuyuki Ikeguchi

Triazine resin was invented by Bayer A.G. in early 1960. Triazine A resin which is based on bisphenol A is a thermosetting resin having excellent heat resistance, electrical properties, adhesion and workability and is worth noticing as a material for laminates, etc. The Triazine resin synthesized from novolak resin has better heat resistance, moisture resistance and flame resistance than Triazine A resin. BT resin which we developed recently is high heat resistant resin of an additional polymerization type and has excellent electrical characteristics and low melting point. Therefore, it has an excellent molding property and can be used as material for heat resitant laminate, molding powder and powder coating.


electrical insulation conference | 1973

New laminates for printed circuit boards

Kohtaro Yanagihara; Soji Sugie; Morio Gaku

The rapid progress in reliability and performance of electronic equipment in recent years calls for further improvement in circuit density, reliability and electrical properties of printed circuit boards on which IC or LSI is installed. This problem can be solved only by new development in such as board material, plating, and manufacturing process and technologies.


Archive | 2002

Semiconductor plastic package and process for the production thereof

Morio Gaku; Nobuyuki Ikeguchi; Nobuyuki Yamane


Archive | 1999

Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package

Morio Gaku; Nobuyuki Ikeguchi; Toshihiko Kobayashi


Archive | 1975

Curable resin compositions of cyanate esters

Morio Gaku; Kazuhiro Suzuki; Kazuyuki Nakamichi


Archive | 1999

Printed wiring board having highly reliably via hole and process for forming via hole

Morio Gaku; Nobuyuki Ikeguchi; Yasuo Tanaka


Archive | 1989

Method for preparing thin copper foil-clad substrate for circuit boards

Koichi Mitsubishi Gas Ishizuka; Morio Gaku; Kenzi Ishii; Hidenori Kinbara; Masakazu Motegi


Archive | 1976

Cyanic acid esters of aromatic polycarbonates

Mineaki Tanigaichi; Morio Gaku; Kazuyuki Ohya; Susumu Motoori; Kazuo Noguchi


Archive | 1974

Method for manufacturing metal foil- or plastic film-overlaid laminate

Shunichi Sato; Masaharu Kurata; Toshiyuki Takao; Sadao Masaki; Toru Notomi; Morio Gaku; Takehiko Moriya


Archive | 1999

Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole

Morio Gaku; Nobuyuki Ikeguchi; Yasuo Tanaka; Yoshihiro Kato

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