Motohiro Tanaka

Thermal Properties of Diamond-Particle-Dispersed Cu-Matrix-Composites Fabricated by Spark Plasma Sintering (SPS)

Diamond-particle-dispersed copper (Cu) matrix composites were fabricated from Cu-coated diamond particles by spark plasma sintering (SPS) process, and the microstructure and thermal properties of the composites fabricated were examined. These composites can well be consolidated in a temperature range between 973K and 1173K and scanning electron microscopy detects no reaction at the interface between the diamond particle and the Cu matrix. The relative packing density of the diamond-Cu composite increases with increasing sintering temperature and holding time, reaching 99.2% when sintered at a temperature of 1173K for a holding time of 2.1ks. Thermal conductivity of the diamond-Cu composite containing 43.2 vol. % diamond increases with increasing relative packing density, reaching a maximum (654W/mK) at a relative packing density of 99.2%. This thermal conductivity is 83% the theoretical value estimated by Maxwell-Eucken equation. The coefficient of thermal expansion of the composites falls in the upper line of Kerner’s model, indicating strong bonding between the diamond particle and the Cu matrix in the composite.

Thermal Conductivity of Cubic Boron Nitride (cBN) Particle Dispersed Al Matrix Composites Fabricated by SPS

Cubic boron nitride (cBN) particle-dispersed-aluminum (Al) matrix composites were fabricated from the powder mixture composed of cBN, pure Al and Al-5mass% Si alloy in liquid and solid co-existent state by spark plasma sintering (SPS) process. Al/cBN composites were well consolidated by heating at a temperature range between 798 K and 876 K for 1.56 ks by SPS. Microstructures of the composites produced were examined by scanning electron microscopy and the reaction between the cBN particle and the Al matrix was not detected. The relative packing density of the Al/cBN composite was higher than 99 % in a volume fraction range of cBN up to 45 %. The thermal conductivity of the composite increased with increasing the cBN content in the composite in a volume fraction range of cBN between 35 and 45 vol. %. The highest thermal conductivity of 305 W/mK was obtained for Al matrix composite containing 45 vol.% cBN particles.

Thermal Properties of Al/Diamond Composites Fabricated in Continuous Solid-Liquid Co-Existent State by SPS

Diamond-particle-dispersed-aluminum (Al) matrix composites were fabricated in continuous solid-liquid co-existent state by spark plasma sintering (SPS) process from the mixture of diamond powders, pure Al powders and Al-5mass%Si alloy powders. The microstructures and thermal conductivities of the composites fabricated were examined. These composites were well consolidated by heating at a temperature range between 798K and 876K for 1.56ks during SPS process. No reaction at the interface between the diamond particle and the Al matrix was observed by scanning electron microscopy for the composites fabricated under the sintering conditions employed in the present study. The relative packing density of the diamond-Al composite fabricated was 99% or higher in a volume fraction range of diamond between 45% and 50%. Thermal conductivity of the diamond-Al composite containing 50 vol.% diamond reached 552W/mK, approximately 95% the theoretical thermal conductivity estimated using Maxwell-Eucken’s equation.