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Motoji Suzuki

NEC

Publication

Featured researches published by Motoji Suzuki.

Archive | 2000

Flip-chip resin sealing structure and resin sealing method

Motoji Suzuki

Archive | 1995

Method of producing a flip chip

Michinobu Tanioka; Motoji Suzuki

Archive | 2002

Method of packaging electronic components with high reliability

Hiroshi Sakai; Motoji Suzuki; Makoto Igarashi; Akihiro Tanaka

Archive | 2002

Method and apparatus for printing solder paste of different thickness on lands on printed circuit board

Hiroshi Sakai; Motoji Suzuki; Makoto Igarashi; Akihiro Tanaka

Archive | 2002

Structure comprising a printed circuit board with electronic components mounted thereon and a method for manufacturing the same

Hiroshi Sakai; Motoji Suzuki; Makoto Igarashi; Akihiro Tanaka

Archive | 2002

Printing mask having protrusions with through holes for printing solder paste on lands on printed circuit board

Hiroshi Sakai; Motoji Suzuki; Makoto Igarashi; Akihiro Tanaka

Archive | 2002

Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy

Shinji Watanabe; Hiroshi Sakai; Motoji Suzuki; Makoto Igarashi; Akihiro Tanaka

Archive | 2001

Circuit board and electronic equipment using the same

Naomi Ishizuka; Akihito Matsumoto; Eiichi Kono; Motoji Suzuki; Akihiro Sato; Hiroshi Matsuoka; Masafumi Kanai

Archive | 2002

Method of mounting electronic parts with Sn-Zn solder free of Pb without reduction in bonding strength

Hiroshi Sakai; Motoji Suzuki; Makoto Igarashi; Akihiro Tanaka

Archive | 2002

Method of packaging electronic components without creating unnecessary solder balls

Hiroshi Sakai; Motoji Suzuki; Makoto Igarashi; Akihiro Tanaka

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