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Featured researches published by Motoo Kawasaki.


Journal of The Surface Finishing Society of Japan | 1970

Electroplating by Jet Flow Method of Electrolyte

Motoo Kawasaki; Shozo Mizumoto

Copper or nickel was electroplated by using a jet flow device, in which the electrolyte flowed through a nozzle in high speed jet dashing perpendicularly against the cathode specimen, and then flowed away. As the results of experiments, it was found that the maximum available current density was 100amp./dm2 or more at a jet flow rate of 200cm/sec.. The flow of electrolyte and other factors in practice were discussed.


Archive | 1979

Vibratory plating apparatus

Hisamine Kobayashi; Motoo Kawasaki; Shozo Mizumoto; Hidemi Nawafune; Sadamasa Suzuki


Archive | 1975

Method of recovering metals from sludges

Motoo Kawasaki; Shozo Mizumoto; Hidemi Nawafune


Archive | 1979

Vibratory plating method

Hisamine Kobayashi; Motoo Kawasaki; Shozo Mizumoto; Hidemi Nawafune; Sadamasa Suzuki


Journal of The Surface Finishing Society of Japan | 1974

Preliminary Study on Electroplating by Vibration Method

Motoo Kawasaki; Shozo Mizumoto; Hidemi Nawafune


Journal of The Surface Finishing Society of Japan | 1988

Effect of heat treatment on mechanical properties of chemically deposited copper films.

Shozo Mizumoto; Hidemi Nawafune; Motoo Kawasaki


Archive | 1979

Surface processing method dependent upon high-speed vibration

Motoo Kawasaki; Shozo Mizumoto; Hidemi Nawafune; Masuo Okada; Atsuhiko Sato; Yasuo Uchikoshiki


Journal of The Surface Finishing Society of Japan | 1985

Mechanical properties of copper films deposited from electroless plating baths containing glycine.

Shozo Mizumoto; Hidemi Nawafune; Motoo Kawasaki; Akemi Kinoshita; Ken Araki


Journal of The Surface Finishing Society of Japan | 1990

Polarization Characteristics in Electroless Copper Plating Baths Containing EDTA as a Complexing Agent

Shozo Mizumoto; Hidemi Nawafune; Kuniyoshi Matsumoto; Motoo Kawasaki; Akemi Kinoshita; Ken Araki


Journal of The Surface Finishing Society of Japan | 1990

Mechanism of Electroless Copper Plating from EDTA-Complex Bath

Shozo Mizumoto; Hidemi Nawafune; Kuniyoshi Matsumoto; Motoo Kawasaki

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