Muhammad Firdaus Mohd Nazeri

Polarization Study of Sn-0.7Cu Solder Alloy in 1M Hydrochloric Solution

Corrosion properties of Sn-0.7Cu solder were investigated in 1 M HCl. The scanning rates used were 0.5, 1.0, 1.5 and 2.0 mVs-1 to study the aggressiveness level of HCl electrolyte in various environment. The morphological, elemental and structural of the samples were compared before and after the corrosion. Scan rate 1.0 mVs-1 was chosen as the most optimum scan rate during corrosion analysis. The morphological analysis observed two types of corrosion product which is compacted and loosely-compacted corrosion product after the samples was polarized in 1 M HCl.

Low Cost Synthesis Method of Two-Dimensional Titanium Carbide MXene

A layered MAX phase of Ti3AlC2 was synthesized through pressureless sintering (PLS) the initial powder of TiH2/Al/C without preliminary dehydrogenation under argon atmosphere at 1350°C. An elegant exfoliations approach was used to prepare a two-dimensional (2D) metal carbide Ti3C2 from layered MAX phase by removing A layer by chemical etching. The use of PLS method instead of any pressure assistance method such as hot isostatic press (HIP) and hot press (HP) lowered the cost of synthesis. Recently, some unique potential of Ti3C2 has been discovered leads to the proposal of potential application, mostly on electronic devices. Morphology and structural analysis was used to confirm the successful of this research.

Potentiodynamic polarization effect on phase and microstructure of SAC305 solder in hydrochloric acid solution

The corrosion analysis of SAC305 lead free solder was investigated in Hydrochloric acid (HCl) solution. Potentiodynamic polarization was used to polarize the SAC305. The effect of polarization on the phase and microstructure were compared to as-prepared SAC305 solder. Potentiodynamic polarization introduces mixed corrosion products on the surface of SAC305 solder. The XRD analysis confirms that the mixed corrosion products emerged on the surface after polarization by formation of SnO and SnO2 of which confirmed that dissolution of Sn was dominant during polarization. Microstructure analysis reveal the presence of gap and porosities produced limits the protection offered by the passivation film.

Microstructure and Phase Analyses on the Corrosion of SAC305 Solder in NaСl Solution

Utilization of Sn-3.0Ag-0.5Cu to replace toxic lead-based solder was only feasible if the corrosion performance of this solder was assured. To obtain this information, potentiodynamic polarization was implement in 3.5 wt. % NaCl. The morphological and structural changes were investigated via crucial characterization methods (SEM and XRD). Collective evidences verified that the needle-like corrosion product confirmed to be made ofSnO, SnO2 and SnCl- and responsible to passivation behavior of this solder.

Effect of Al Additions on Corrosion Performance of Sn-9Zn Solder in Acidic Solution

The utilization of Sn-Zn based solder on electronic product was only feasible if the corrosion performance of this solder was assured. To achieve this, micro-alloying eutectic Sn-9Zn with Al was proposed. The corrosion performance was evaluated by using potentiodynamic polarization in 1 M HCl at constant scan rate. The microstructure changes due to corrosion exposure was also investigated to further understand the corrosion behaviour changes due to additions of Al. Overall corrosion rate was reduced with the micro-alloying process. Refinement of Zn-rich phase was found to help in producing much lower corrosion current and better passivation film formation on the surface due to the additions of Al. This modification deemed promising and further work should be explored in the future.

Study of Mxene: Characterization and Radiation Properties of Two-Dimensional Titanium Carbide

In this study, radon concentration of 2D Titanium Carbide MXene Ti3C2 was studied by using an established radon monitor. A layered MAX phase of Ti3AlC2 was synthesized through pressureless sintering (PLS) the initial powder of TiH2/Al/C without preliminary dehydrogenation under argon atmosphere at 1350 °C. An elegant exfoliation approach was used to eliminates Al from its precursor to form a layered-structure of Ti3C2. Morphological and structural properties of this 2D material also studied. SEM images shows two types of morphology which is a layer of Ti3C2 and the agglomerates Al2O3 with graphite. XRD pattern reveals three phases in this material which is a rhombohedral Al2O3, rhombohedral graphite and rhombohedral Ti3C2 phases. Radon concentration for this material for five consecutive days explains the radiation level of this material is under the suggestion value from US Environmental Protection Agency (EPA).

Corrosion Performance of Sn-9Zn and Sn-0.7Cuin 3.5% NaCl Solution

Corrosion properties of Sn-9Zn and Sn-0.7Cu solder were investigated in 3.5 wt.% NaCl. The scanning rates used were fixed at 1.0mVs-1 to study the effect of diffferent adding element which is Cu and Zn into the corrrosion properties of Sn-based solder. The morphological and structural properties of the samples were compared before and after the corrosion. The morphological analysis observed two types of corrosion product which is compacted and loosely-compacted corrosion product after the samples was polarized in 3.5% NaCl solution.

Corrosion Properties of Sn-9Zn Solder in Acidic Solution

The corrosion properties of Sn-9Zn lead-free solder was studied through potentiodynamic polarization in different concentration of hydrochloric acid (0.5, 1.0, 1.5, 2.0 M). Two types of polarization profile were observed for Sn-9Zn solder at lower concentration acid (0.5 to 1.0 M) and one at higher concentration acids (1.5 to 2.0 M). The morphological analysis showed that two distinctive structures of lamellar-like groove and irregular shaped of the corrosion product compounds formed on the solder surface after being polarized at different concentrations. Phase and elemental analyses revealed the formation of mixed corrosion product such as SnO, SnO2, ZnO, ZnO2, and Zn(OH)2 on the surface after polarization.

Corrosion Study of SAC305 Solder in Acidic Solution

Corrosion resistance performance of Sn-3.0Ag-0.5Cu (SAC305) was evaluated in 1 M hydrochloride acid through potentiodynamic polarization. SAC305 shows active-passive corrosion behavior in acidic solution with two dissolution peaks detected in anodic branch. Microstructure analysis revealed that the corrosion product deposited on the surface after polarization was porous and uneven. This limits the protection offered by the passivation film as the porous structure allows further corrosion attack on the underlying solder.