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Dive into the research topics where Murid Hussain is active.

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Featured researches published by Murid Hussain.


Micron | 2013

Effect of TiN coating on microstructure of Tif/Al composite

Ziyang Xiu; Guoqin Chen; M. Wang; Murid Hussain

In the present work, Ti fibre reinforced Al matrix composites (Ti(f)/Al) were fabricated by pressure infiltration method. In order to suppress the severe Ti-Al reaction and reduce the formation of brittle TiAl(3) phase, a TiN layer was coated on Ti fibres by an arc ion plating method before composite preparation. A thin TiN layer was coated on the Ti fibre surface, and the maximum and minimum thickness values of layer were about 3.5 and 1μm, respectively. Prefer orientation of TiN on (111) and (200) was found by XRD analysis. A thin and uniform TiAl(3) layer was observed in Ti(f)/Al composite. However, after coated with TiN layer, no significant reaction layer was found in (Ti(f)+TiN)/Al composite. Segregation of Mg element was found in Ti(f)/Al composite, and the presence of TiN layer showed little effect on this behaviour. Due to the large CTE difference between Ti fibre and Al matrix, high density dislocations were observed in the Al matrix. Meanwhile, fine dispersed Mg(2)Al(3) phases were also found in Al matrix. Ti fibre is mainly composed of α- and β-Ti. Small discontinuous needle-like TiAl(3) phases were detected at TiN/Al interface, which implies that the presence of TiN layer between the Ti fibre and Al matrix could effectively hinder the formation of TiAl(3) phases.


Transactions of Nonferrous Metals Society of China | 2013

Effect of heat treatment on microstructure and thermophysical properties of diamond/2024 Al composites

Ziyang Xiu; Xu Wang; Murid Hussain; Chao Feng; Longtao Jiang

Abstract 50% diamond particle (5 μm) reinforced 2024 aluminum matrix (diamond/2024 Al) composites were prepared by pressure infiltration method. Diamond particles were distributed uniformly without any particle clustering, and no apparent porosities or significant casting defects were observed in the composites. The diamond-Al interfaces of as-cast and annealed diamond/2024 Al composites were clean, smooth and free from interfacial reaction product. However, a large number of Al2Cu precipitates were found at diamond-Al interface after aging treatment. Moreover, needle-shaped Al2MgCu precipitates in Al matrix were observed after aging treatment. The coefficient of thermal expansion (CTE) of diamond/2024 Al composites was about 8.5×10−6 °C−1 between 20 and 100 °C, which was compatible with that with chip materials. Annealing treatment showed little effect on thermal expansion behavior, and aging treatment could further decrease the CTE of the composites. The thermal conductivity of obtained diamond/ 2024 Al composites was about 100 W/(m·K), and it was slightly increased after annealing while decreased after aging treatment.


Journal of Materials Science | 2014

Microstructure and properties of Sip/Al–20 wt% Si composite prepared by hot-pressed sintering technology

Jun Liu; Ziyang Xiu; Xue Liang; Qiang Li; Murid Hussain; Jing Qiao; Longtao Jiang

In the present work, 50xa0vol% Sip/Al–20Si composite was prepared by hot-pressed sintering technology. Si particles were uniformly distributed in the Sip/Al–20Si composite, and only the presence of Si and Al phases were detected by XRD analysis. Dislocations, twins, and stacking faults were found in the Si particles. Several Si phases were found to be precipitated between Al matrix and Si particles. Si/Al interface was clean, smooth, and free from interfacial product. HRTEM indicated that the Si/Al interface was well bonded. The average CTE and thermal conductivity (TC) of Sip/Al–20Si composite were 11.7xa0×xa010−6/°C and 118xa0W/(mxa0K), respectively. Sip/Al–20Si composite also demonstrated high mechanical properties (bending strength of 386xa0MPa). Thus, the comprehensive performance (low density and CTE, high TC, and mechanical properties) makes the Sip/Al–20Si composite very attractive for application in electron packaging.


Acta Metallurgica Sinica (english Letters) | 2017

Electrical Discharge Machining of Al2024-65 vol% SiC Composites

Wenshu Yang; Guoqin Chen; Ping Wu; Murid Hussain; Jia-Bing Song; Ronghua Dong; Gaohui Wu

In the present work, the wire electrical discharge machining (WEDM) process of the 65xa0vol% SiCp/2024Al composite prepared by pressure infiltration methods has been investigated. The microstructure of the machined composite was characterized by scanning electron microscope, the average surface roughness (Ra), X-ray diffraction, X-ray photoelectron spectroscopy and transmission electron microscopy (TEM) techniques. Three zones from the surface to the interior (melting zone, heat affected zone and un-affected zone) were found in the machined composites, while the face of SiC particles on the surface toward the outside was “cut” to be flat. Increase in Al and Si but decrease in C and O were observed in the core areas of the removed particles. Si phase, which was generated due to the decomposition of SiC, was detected after the WEDM process. The irregular and spherical particles were further observed by TEM. Based on the microstructure observation, it is suggested that the machining mechanism of 65xa0vol% SiCp/2024Al composite was the combination of the melting of Al matrix and the decomposition of SiC particles.


Journal of Alloys and Compounds | 2015

Aging behavior of 6061Al matrix composite reinforced with high content SiC nanowires

Ronghua Dong; Wenshu Yang; Zhenhe Yu; Ping Wu; Murid Hussain; Longtao Jiang; Gaohui Wu


Materials Characterization | 2015

Microstructure characterization of SiC nanowires as reinforcements in composites

Ronghua Dong; Wenshu Yang; Ping Wu; Murid Hussain; Ziyang Xiu; Gaohui Wu; Pingping Wang


Journal of Materials Science & Technology | 2015

Microstructure and Mechanical Properties of 45 vol.% SiCp/7075Al Composite

Ziyang Xiu; Wenshu Yang; Ronghua Dong; Murid Hussain; Longtao Jiang; YongXing Liu; Gaohui Wu


Materials & Design | 2015

Effect of Gd content on interfacial microstructures and mechanical properties of Cf/Mg composite

Shaofeng Zhang; Guoqin Chen; Risheng Pei; Murid Hussain; Yaping Wang; Daguang Li; Pingping Wang; Gaohui Wu


Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2015

High content SiC nanowires reinforced Al composite with high strength and plasticity

Ronghua Dong; Wenshu Yang; Ping Wu; Murid Hussain; Gaohui Wu; Longtao Jiang


Materials & Design | 2014

Interfacial microstructure and its effect on thermal conductivity of SiCp/Cu composites

Guoqin Chen; Wenshu Yang; Ronghua Dong; Murid Hussain; Gaohui Wu

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Gaohui Wu

Harbin Institute of Technology

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Ronghua Dong

Harbin Institute of Technology

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Wenshu Yang

Harbin Institute of Technology

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Longtao Jiang

Harbin Institute of Technology

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Ziyang Xiu

Harbin Institute of Technology

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Guoqin Chen

Harbin Institute of Technology

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Jing Qiao

Harbin Institute of Technology

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Pingping Wang

Harbin Institute of Technology

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Zhenhe Yu

Harbin Institute of Technology

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Khairiraihanna Johari

Universiti Teknologi Petronas

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