Mustapha Faraji

Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage

The aim of the present work is to study the thermal performance of a hybrid heat sink used for cooling management of protruding substrate-mounted electronic chips. The power generated in electronic chips is dissipated in phase change material (PCM) (n-eicosane with melting temperature T m = 36°C) that filled a rectangular enclosure. The advantage of using this cooling strategy is that the PCMs are able to absorb a high amount of heat generated by electronic component (EC) without acting the fan, during the charging process (melting of the PCM). A two-dimensional mathematical model was developed in order to analyze and optimize a heat sink. The governing equations for masse, momentum, and energy transport were developed and discretized by using the volume control approach. The resulting algebraic equations were next solved iteratively by using tri diagonal matrix algorithm. A series of numerical investigations were conducted in order to examine the effects of the heat generation based Rayleigh number, Ra, and the position of the bottom electronic component, L h , on the thermal behavior of the proposed cooling system. Results are obtained for velocity and temperature distributions, maximum temperature heat sources, percentage contribution of plate (substrate) heat conduction on the heat removal from electronic components, temperature profile within finite conductive plate and local heat flux density at the plate―modules/PCM interface. The effect of these two key parameters on the electronic component working time (time required by electronic components to reach a critical temperature, T cr ) was analyzed.

Cooling management of a protruding electronic components by using a phase change material heat sink

The aim of the present work is to study the thermal performance of a hybrid heat sink used for cooling management of protruding substrate-mounted electronic chips. The power generated in electronic chips is dissipated in phase change material (PCM) that filled a rectangular enclosure. The advantage of using this cooling strategy is that the PCMs are able to absorb a high amount of heat generated by IC without operating the fan. A (2D) mathematical model was developed for a heat sink. Several experiment simulations were conducted to analyze the effect of the substrate thermal conductivity on the cooling of the chips.

Numerical Study of Free Convection Dominated Melting in an Isolated Cavity Heated by Three Protruding Electronic Components

This paper presents the results of a numerical study of the melting and natural convection in a rectangular enclosure heated with three discrete protruding electronic components (heat sources) mounted on a conducting vertical plate. The heat sources generate heat at a constant and uniform volumetric rate. A part of the power generated in the heat sources is dissipated in phase change material (PCM, n-eicosane with melting temperature, Tm = 36°C) that filled the enclosure. The advantage of using this cooling strategy is that the PCMs are able to absorb a high amount of heat generated by electronic components without activating the fan. To investigate the thermal behavior of the proposed cooling system, a mathematical model, based on the mass, momentum, and energy conservation equations, was developed. The governing equations are next discretized using a finite volume method in a staggered mesh, and a pressure correction equation method is employed for the pressure-velocity coupling. The energy conservation equation for the PCM is solved using the enthalpy method. The solid regions (substrate and heat sources) are treated as fluid regions with infinite viscosity. A parametric study was conducted in order to optimize the thermal performance of the heat sink. The optimization involves determination of the key parameter values that maximize the time required by the electronic component to reach the critical temperature (T < Tcr).

Thermal Control of Protruding Electronic Components with PCM: A Parametric Study

This work deals with the melting and natural convection in a rectangular enclosure heated from three discrete protruding electronic components (heat sources) mounted on a conducting vertical plate (substrate). The heat sources generate heat at a constant and uniform volumetric rate. A part of the power generated in the heat sources is dissipated to the phase change material (PCM, n-eicosane with a melting temperature T m = 36°C) that filled the enclosure. To investigate the thermal behavior of the proposed heat sink, a mathematical model, based on the mass, momentum, and energy conservation equations was developed. The model has been verified and then validated comparing the melting front with available experimental results. Numerical investigations have been conducted in order to examine the effects of the electronic components thickness and the plate thermal diffusivity on the maximum temperature of electronic components. The percentage contribution of plate heat conduction on the total removed heat and temperature profile in the plate have also been analyzed. Correlations for the nondimensional secured working time (time to reach the threshold temperature, T cr = 75°C) and its corresponding melt fraction were derived.

Numerical Analysis of a Hybrid Heat Sink Using Phase Change Material: Application to Cooling of Electronic Components

The aim of the present work is to study the thermal performance of a hybrid heat sink used for cooling management of protruding substrate-mounted electronic chips. The power generated in electronic chips is dissipated in phase change material (PCM n-ecosane with melting temperature Tm = 36°C) that filled a rectangular enclosure. The advantage of using this cooling strategy is that the PCMs are able to absorb a high amount of heat generated by electronic component (EC) without acting the fan, during the charging process (melting of the PCM). A (2D) mathematical model was developed in order to analyze and optimize a heat sink. The governing equations for masse, momentum and energy transport were developed and discretised by using the volume control approach. The resulting algebraic equations were next solved iteratively by using TDMA algorithm. Numerical investigations were conducted in order to optimize the thermal performance of the heat sink. The optimization involves determination of the key parameters of the heat sink that maximize the time required by the base of the electronic component to reach a critical temperature.Copyright