N. Hrauda

X-ray Nanodiffraction on a Single SiGe Quantum Dot inside a Functioning Field-Effect Transistor

For advanced electronic, optoelectronic, or mechanical nanoscale devices a detailed understanding of their structural properties and in particular the strain state within their active region is of utmost importance. We demonstrate that X-ray nanodiffraction represents an excellent tool to investigate the internal structure of such devices in a nondestructive way by using a focused synchotron X-ray beam with a diameter of 400 nm. We show results on the strain fields in and around a single SiGe island, which serves as stressor for the Si-channel in a fully functioning Si–metal–oxide semiconductor field-effect transistor.

Phase separation and exchange biasing in the ferromagnetic IV-VI semiconductor Ge1−xMnxTe

Ferromagnetic Ge1−xMnxTe grown by molecular beam epitaxy with Mn content of xMn≈0.5 is shown to exhibit a strong tendency for phase separation. At higher growth temperatures apart from the cubic Ge0.5Mn0.5Te, a hexagonal MnTe and a rhombohedral distorted Ge0.83Mn0.17Te phase is formed. This coexistence of antiferromagnetic MnTe and ferromagnetic Ge0.5Mn0.5Te results in magnetic exchange-bias effects.

Quantitative determination of Ge profiles across SiGe wetting layers on Si (001)

The peak positions in photoluminescence spectra of Ge wetting layers (WL) deposited at 700 °C were measured versus the Ge coverage with an extremely high relative resolution of 0.025 monolayers. A nearly linear redshift of the peaks with increasing Ge coverage is observed. We derived quantitative WL composition profiles by fitting this shift, and its dependence on the deposition temperature of the capping layer (Tc), to results of band structure calculations. Despite the high growth temperature, the Ge content in the WL exceeds 80%. It is shown that the composition profile is dominated by surface segregation of Ge on Si.

Strain engineering in Si via closely stacked, site-controlled SiGe islands

The authors report on the fabrication and detailed structural characterization of ordered arrays of vertically stacked SiGe/Si(001) island pairs. By a proper choice of growth parameters, islands which have both large sizes and high Ge fraction are obtained in the upper layer. Finite element method calculations of the strain distribution reveal that (i) the Si spacer between a pair of islands can act as a lateral quantum dot molecule made of four nearby dots for electrons and (ii) the tensile strain in a Si cap deposited on top of the stack is significantly enhanced with respect to a single layer.

Analysis of periodic dislocation networks using x-ray diffraction and extended finite element modeling

We combine the extended finite element method with simulations of diffracted x-ray intensities to investigate the diffusely scattered intensity due to dislocations. As a model system a thin PbSe epitaxial layer grown on top of a PbTe buffer on a CdTe substrate was chosen. The PbSe film shows a periodic dislocation network where the dislocations run along the orthogonal ⟨110⟩ directions. The array of dislocations within this layer can be described by a short range order model with a narrow distribution.

Algorithms for the calculation of X‐ray diffraction patterns from finite element data

A set of algorithms is presented for the calculation of X-ray diffraction patterns from strained nanostructures. Their development was triggered by novel developments in the recording of scattered intensity distributions as well as in simulation practice. The increasing use of two-dimensional CCD detectors in X-ray diffraction experiments, with which three-dimensional reciprocal-space maps can be recorded in a reasonably short time, requires efficient simulation programs to compute one-, two- and three-dimensional intensity distributions. From the simulation point of view, the finite element method (FEM) has become the standard tool for calculation of the strain and displacement fields in nanostructures. Therefore, X-ray diffraction simulation programs must be able to handle FEM data properly. The algorithms presented here make use of the deformation fields calculated on a mesh, which are directly imported into the calculation of diffraction patterns. To demonstrate the application of the developed algorithms, they were applied to several examples such as diffraction data from a dislocated quantum dot, from a periodic array of dislocations in a PbSe epilayer grown on a PbTe pseudosubstrate, and from ripple structures at the surface of SiGe layers deposited on miscut Si substrates.

Strained MOSFETs on ordered SiGe dots

The potential of strained DOTFET technology is demonstrated. This technology uses a SiGe island as a stressor for a Si capping layer, into which the transistor channel is integrated. The structure information is extracted from AFM measurements of fabricated samples. Strain on the upper surface of a 30 nm thick Si layer is in the range of 0.7%, as supported by finite element calculations. The Ge content in the SiGe island is 30% on average, showing an increase towards the top of the island. Based on realistic structure information, three-dimensional strain profiles are calculated and device simulations are performed. Up to 15% enhancement of the NMOS saturation current is predicted.

Closely spaced SiGe barns as stressor structures for strain-enhancement in silicon

We present tensile and compressive strains realized within the same Si capping layer on an array of SiGe islands grown on pit-patterned (001) Si substrates. The strain distributions are obtained from synchrotron X-ray diffraction studies in combination with three-dimensional finite element calculations and simulations of the diffracted intensities. For barn-shaped islands grown at 720 °C with average Ge contents of 30%, the Si cap layer is misfit- and threading-dislocation free and exhibits compressive strains as high as 0.8% in positions between the islands and tensile strains of up to 1% on top of the islands.