N. Inagaki

Improved adhesion between plasma-treated polyimide film and evaporated copper

The surface of polyimide film, Kapton® H, was modified with Ar, N2, NO, NO2, O2, CO, and CO2 plasmas to improve its adhesion to evaporated copper. The plasma treatments led to bond scission of the imide groups in the Kapton film to form carboxyl and secondary amide groups, and, as a result, the surface of the Kapton film changed from hydrophobic to hydrophilic. The Ar-, NO-, and NO2-plasma treatments enhanced the adhesion between the Kapton film and copper, but the O2-, CO-, and CO2-plasma treatments did not. The roughness profile determined with an atomic force microscope showed that the plasma treatment removed a surface layer of the Kapton film, and the surface contained needle-shaped protuberances. The ATR IR spectra for the copper side torn-off from the Kapton film/copper joints showed the formation of coordinate bonds between carboxyl groups and copper atoms at the interface of the Kapton film and evaporated copper. The improved adhesion may be due to the formation of coordinate bonds between carbox...

Improvement in the adhesion between copper metal and polyimide substrate by plasma polymer deposition of cyano compounds onto polyimide

The surface modification of Kapton film by means of plasma polymer deposition is discussed from the viewpoint of improving the adhesion between copper metal and Kapton film substrate. Plasma polymers of AN (acrylonitrile) and FN (fumaronitrile) were used for the surface modification, and the adhesion between the copper metal and the plasma polymer-coated Kapton film was evaluated by the T-peel strength measurement. The surfaces of peeled layers were analyzed by X-ray photoelectron spectroscopy (XPS) and the failure mode is discussed. The plasma polymer deposition of AN and FN shows an effective improvement in the adhesion between the copper metal and Kapton film; in particular, the AN plasma polymer deposition increased the peel strength 4.3 times. Failure occurred mainly in the Kapton film, and the adhesion between the AN plasma polymer and the Kapton film and that between the copper metal and the AN plasma polymer were found to be quite strong.

Adsorption of carbon dioxide in plasma polymers prepared from silicon compounds and carbon dioxide separation membrane

SummaryThree silicon compounds, dimethyldimethoxysilane (DMDMOS), decamethylcyclopentasiloxane (DMCPS), and 1,1,3,3-tetramethyldisiloxane (TMDSO), were plasma-polymerized, and the solubility coefficient and the permeation coefficient of carbon dioxide and nitrogen gas were determined. The permeation properties of the deposited films were discussed. The plasma polymers formed from DMDMOS, DMCPS, and TMDSO showed preferential solubility for carbon dioxide. The solubility coefficient of carbon dioxide was closely related to the concentration of Si-(O-)4 moieties in the plasma polymers. However, these plasma polymers showed no selective permeation of carbon dioxide. The diffusion process rather than the solution process controlled the permeation of carbon dioxide across the plasma polymers. Plasma polymers formed from silicon compounds, if the polymers are less cross-linked, are expected to be a good material for CO2-selective membrane.

Gas selective plasma polymerization membrane

Abstract Two silicon- and six fluorine-containing compounds were chosen as monomers and plasma-polymerized for preparation of permselective membranes. The oxygen and nitrogen permeability coefficients and separation factor (P O2/P N2) of the plasma films deposited on Millipore membranes were discussed, Plasma polymers deposited from silicon-containing compounds, hexamethyldisiloxane and hexamethyl-disilane, and from aliphatic fluorine-containing compounds, tetrafluoroethylene, and perfluoromethyl-cyclohexane, are not adequate materials for oxygen-selective membrane. Plasma polymers deposited from aromatic fluorine-containing compounds, perfluoro-benzene, pentafluorobenzene, trifluoro-benzene, and ditrifluoromethyl-benzene, however, are adequate materials for oxygen-selective membranes. The CF4 addition into the aromatic fluorine-containing compounds leads to the formation of plasma polymers with improved separation factor (P O2/P N2). The CF4 addition brought about changes in fluorinated carbon distributi...

Plasma polymer thin films of zinc phthalocyanies for NO2 gas sensor device

Zinc phthalocyanines without substituent (ZnPc) and with hydroxymethyl (ZnOc-CH 2 OH), and phthalimidomethyl substituents (ZnPc-CH 2 N[C(O)] 2 Ph) were plasma-polymerized and the application of the deposited plasma polymer films for NO 2 gas sensor device has been discussed. The chemical composition of the deposited plasma polymer films was analyzed by electronic spectroscopy and XPS. The electronic and XPS spectra showed that the plasma polymer films possessed the π-extended electron system and the zinc chelation, although a part of them was degraded by plasma. From the stability of the zinc chelation, the plasma polymer film of ZnPc was chosen as a suitable material for NO 2 gas sensor device. The NO 2 gas sensor device composing of the ZnPc plasma polymer film showed a sensitivity toward NO 2 gas in ranges of 100 to 1000 ppm.